XC3S50A Xilinx Corp., XC3S50A Datasheet - Page 65

• Manufacturer Part Number: XC3S50A
• Description: Spartan-3a Fpga Family Data Sheet
• Manufacturer: Xilinx Corp.

Table 58: Maximum User I/O by Package (Continued)
Electronic versions of the package pinout tables and foot-
prints are available for download from the Xilinx website.
Using a spreadsheet program, the data can be sorted and
reformatted according to any specific needs. Similarly, the
ASCII-text file is easily parsed by most scripting programs.
http://www.xilinx.com/bvdocs/publications/s3a_pin.zip
Package Thermal Characteristics
The power dissipated by an FPGA application has
implications on package selection and system design. The
power consumed by a Spartan-3A FPGA is reported using
either the
calculator integrated in the Xilinx ISE development software.
Table 59
Table 59: Spartan-3A Package Thermal Characteristics
DS529-4 (v1.5) July 10, 2007
Product Specification
Notes:
1.
XC3S400A
XC3S700A
XC3S700A
XC3S1400A
XC3S1400A
Package
TQG144
FGG320
FGG400
FGG484
FGG676
FTG256
TQ144
FG320
FG400
FG484
FG676
FT256
Device
Some VREFs are on INPUT pins. See pinout tables for details.
provides the thermal characteristics for the various
XPower Power Estimator
R
XC3S1400A
XC3S1400A
XC3S200A
XC3S400A
XC3S200A
XC3S400A
XC3S400A
XC3S700A
XC3S700A
XC3S50A
XC3S50A
Device
Package
FG400
FG484
FG676
Input-Only
Maximum
Junction-to-Case
User I/Os
and
311
311
372
375
502
or the
(θ
12.4
12.2
11.3
8.2
8.9
9.4
9.4
8.2
7.9
6.1
5.8
JC
)
XPower Analyzer
Maximum
Input-
Only
63
63
84
87
94
Junction-to-
Board (θ
www.xilinx.com
31.9
27.6
27.2
21.0
18.3
14.9
15.0
13.0
12.8
9.9
9.4
Differential
Maximum
Pairs
JB
142
142
165
165
227
)
Spartan-3A FPGA package offerings. This information is
also available using the Thermal Query tool on xilinx.com
(http://www.xilinx.com/cgi-bin/thermal/thermal.pl).
The junction-to-case thermal resistance (θ
difference between the temperature measured on the
package body (case) and the die junction temperature per
watt of power consumption. The junction-to-board (θ
value similarly reports the difference between the board and
junction temperature. The junction-to-ambient (θ
reports the temperature difference between the ambient
environment and the junction temperature. The θ
reported at different air velocities, measured in linear feet
per minute (LFM). The “Still Air (0 LFM)” column shows the
θ
drops with increasing air flow.
JA
value in a system without a fan. The thermal resistance
Still Air
(0 LFM)
52.1
35.8
35.4
30.1
28.8
25.5
25.0
23.1
22.3
19.5
17.8
155
155
194
195
313
I/O
Junction-to-Ambient (θ
at Different Air Flows
INPUT
250 LFM
46
46
61
62
67
40.5
29.4
29.0
24.1
23.2
20.1
19.8
17.9
17.4
14.7
13.5
All Possible I/Os by Type
DUAL
52
52
52
52
52
500 LFM
34.6
28.4
28.1
23.0
22.1
18.8
18.6
16.7
16.2
13.4
12.4
VREF
JA
26
26
33
34
38
)
Pinout Descriptions
750 LFM
32.5
28.1
27.7
22.6
21.3
18.0
17.9
16.0
15.5
12.8
11.8
JC
CLK
) indicates the
32
32
32
32
32
JA
JA
) value
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
Units
value is
JB
N.C.
)
17
0
0
3
0
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