PBSS302ND NXP Semiconductors, PBSS302ND Datasheet

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PBSS302ND

Manufacturer Part Number
PBSS302ND
Description
Pbss302nd 40 V, 4 A Npn Low Vcesat Biss Transistor
Manufacturer
NXP Semiconductors
Datasheet

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Part Number
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Part Number:
PBSS302ND115
Manufacturer:
NXP Semiconductors
Quantity:
25 275
Part Number:
PBSS302NDЈ¬115
Manufacturer:
NXP
Quantity:
3 000
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
NPN low V
small Surface-Mounted Device (SMD) plastic package.
PNP complement: PBSS302PD.
I
I
I
I
I
I
I
I
I
I
I
Table 1.
[1]
[2]
Symbol
V
I
I
R
C
CM
CEO
CEsat
PBSS302ND
40 V, 4 A NPN low V
Rev. 02 — 18 February 2008
Ultra low collector-emitter saturation voltage V
4 A continuous collector current capability I
Up to 15 A peak current
Very low collector-emitter saturation resistance
High efficiency due to less heat generation
Power management functions
Charging circuits
DC-to-DC conversion
MOSFET gate driving
Power switches (e.g. motors, fans)
Thin Film Transistor (TFT) backlight inverter
Device mounted on a ceramic Printed-Circuit Board (PCB), Al
Pulse test: t
CEsat
Quick reference data
Parameter
collector-emitter voltage
collector current
peak collector current
collector-emitter
saturation resistance
p
Breakthrough In Small Signal (BISS) transistor in a SOT457 (SC-74)
300 s;
0.02.
CEsat
Conditions
open base
single pulse;
t
I
I
p
C
B
(BISS) transistor
= 600 mA
= 6 A;
1 ms
C
CEsat
2
O
[1]
[2]
3
, standard footprint.
Min
-
-
-
-
Typ
-
-
-
55
Product data sheet
Max
40
4
15
75
Unit
V
A
A
m

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PBSS302ND Summary of contents

Page 1

... PBSS302ND NPN low V Rev. 02 — 18 February 2008 1. Product profile 1.1 General description NPN low V small Surface-Mounted Device (SMD) plastic package. PNP complement: PBSS302PD. 1.2 Features I Ultra low collector-emitter saturation voltage continuous collector current capability peak current ...

Page 2

... T amb Rev. 02 — 18 February 2008 PBSS302ND NPN low V (BISS) transistor CEsat Simplified outline Symbol Marking code C7 Min ...

Page 3

... P tot (mW) 1200 (1) 800 (2) (3) (4) 400 standard footprint 2 3 Rev. 02 — 18 February 2008 PBSS302ND NPN low V (BISS) transistor CEsat Min Max - 150 65 +150 65 +150 10 % and pulse width t 10 ms. p 006aaa270 75 125 175 amb 2 2 © ...

Page 4

... Product data sheet Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to solder point O , standard footprint Rev. 02 — 18 February 2008 PBSS302ND NPN low V CEsat Conditions Min Typ [1] in free air - - [ [ [ ...

Page 5

... Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PBSS302ND_2 Product data sheet Rev. 02 — 18 February 2008 PBSS302ND NPN low V (BISS) transistor CEsat 006aaa272 (s) p 006aaa273 ...

Page 6

... Boff turn-on time storage time fall time turn-off time transition frequency 100 MHz collector capacitance MHz 300 s; 0.02. p Rev. 02 — 18 February 2008 PBSS302ND NPN low V CEsat Min Typ = ...

Page 7

... Fig 6. Collector current as a function of 006aaa275 1.6 V BEsat (V) 1.2 0.8 0 (mA) C (1) T (2) T (3) T Fig 8. Base-emitter saturation voltage as a function of Rev. 02 — 18 February 2008 PBSS302ND NPN low V CEsat 14 I (mA) = 400 B 12 360 320 280 10 240 200 160 8 120 ...

Page 8

... Fig 10. Collector-emitter saturation voltage as a 006aaa281 10 R CEsat ( ) 10 (1) (2) ( (mA) C (1) I (2) I (3) I Fig 12. Collector-emitter saturation resistance as a Rev. 02 — 18 February 2008 PBSS302ND NPN low V CEsat 1 1 (1) ( amb /I = 100 ...

Page 9

... PBSS302ND_2 Product data sheet (probe) oscilloscope 450 0 Bon Boff Rev. 02 — 18 February 2008 PBSS302ND NPN low V CEsat I (100 %) Bon I Boff off (probe) o oscilloscope 450 ...

Page 10

... Product data sheet 3.1 2.7 6 3.0 1.7 2.5 1.3 pin 1 index 1 0.95 1.9 Dimensions in mm Packing methods Package Description SOT457 4 mm pitch tape and reel pitch tape and reel; T2 Rev. 02 — 18 February 2008 PBSS302ND NPN low V (BISS) transistor CEsat 1.1 0 0.6 0 0.40 0.26 0.25 0.10 04-11-08 [1] Packing quantity 3000 ...

Page 11

... Product data sheet 3.45 1.95 0.95 3.30 2.825 1.60 1.70 3.10 3.20 Dimensions in mm 5.30 1.40 4.30 Dimensions in mm Rev. 02 — 18 February 2008 PBSS302ND NPN low V (BISS) transistor CEsat solder lands solder resist 0.45 0.55 occupied area solder paste msc422 0.45 1.45 4.45 msc423 © NXP B.V. 2008. All rights reserved. solder lands solder resist occupied area ...

Page 12

... FE information”: added “Soldering”: added information”: updated Product data sheet Rev. 02 — 18 February 2008 PBSS302ND NPN low V (BISS) transistor CEsat Change notice Supersedes - PBSS302ND_1 conditions amended 2 footprint amended - - © NXP B.V. 2008. All rights reserved ...

Page 13

... Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com Rev. 02 — 18 February 2008 PBSS302ND NPN low V (BISS) transistor CEsat © NXP B.V. 2008. All rights reserved ...

Page 14

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com (BISS) transistor CEsat All rights reserved. Date of release: 18 February 2008 Document identifier: PBSS302ND_2 ...

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