saa5547ps NXP Semiconductors, saa5547ps Datasheet - Page 2

• Manufacturer Part Number: saa5547ps
• Description: Saa550x; Saa554x Tv Microcontrollers With Closed Captioning Cc And On-screen Display Osd
• Manufacturer: NXP Semiconductors

Philips Semiconductors
CONTENTS
1
2
3
4
5
6
6.1
6.2
7
7.1
8
8.1
8.2
8.3
8.4
8.5
8.6
9
9.1
9.2
9.3
10
10.1
10.2
10.3
10.4
11
11.1
11.2
11.3
11.4
12
13
13.1
14
14.1
14.2
14.3
14.4
15
2000 Feb 23
TV microcontrollers with Closed Captioning (CC)
and On-Screen Display (OSD)
FEATURES
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING INFORMATION
Pinning
Pin description
MICROCONTROLLER
Microcontroller features
MEMORY ORGANIZATION
ROM bank switching
RAM organisation
Data memory
SFR memory
Character set feature bits
External (auxiliary) memory
REDUCED POWER MODES
Idle mode
Power-down mode
Standby mode
I/O FACILITY
I/O ports
Port type
Port alternative functions
LED support
INTERRUPT SYSTEM
Interrupt enable structure
Interrupt enable priority
Interrupt vector address
Level/edge interrupt
TIMER/COUNTER
WATCHDOG TIMER
Watchdog Timer operation
PULSE WIDTH MODULATORS
PWM control
Tuning Pulse Width Modulator (TPWM)
TPWM control
Software ADC (SAD)
I
2
C-BUS SERIAL I/O
2
15.1
16
16.1
16.2
16.3
16.4
17
17.1
18
18.1
18.2
18.3
18.4
18.5
18.6
18.7
18.8
18.9
18.10
18.11
18.12
18.13
18.14
18.15
19
20
21
22
23
24
25
26
26.1
26.2
26.3
26.4
27
28
29
I
MEMORY INTERFACE
Memory structure
Memory mapping
Addressing memory
Page clearing
DATA CAPTURE
Data Capture features
DISPLAY
Display features
Display modes
Display feature descriptions
Character and attribute coding
Screen and global controls
Text display controls
Display positioning
Character set
ROM addressing
Redefinable characters
Display synchronization
Video/Data switch (Fast Blanking) polarity
Video/data switch adjustment
RGB brightness control
Contrast reduction
MEMORY MAPPED REGISTERS (MMR)
LIMITING VALUES
CHARACTERISTICS
QUALITY AND RELIABILITY
APPLICATION INFORMATION
ELECTROMAGNETIC COMPATIBILITY
(EMC) GUIDELINES
PACKAGE OUTLINES
SOLDERING
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Manual soldering
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
DEFINITIONS
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I
2
C-bus port selection
Preliminary specification
2
C COMPONENTS
SAA55xx