ISL6322_07 INTERSIL [Intersil Corporation], ISL6322_07 Datasheet - Page 7

• Manufacturer Part Number: ISL6322_07
• Description: Four-Phase Buck PWM Controller with Integrated MOSFET Drivers and I2C Interface for Intel VR10, VR11, and AMD Applications
• Manufacturer: INTERSIL [Intersil Corporation]

Absolute Maximum Ratings
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
Supply Voltage, PVCC . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +15V
BOOT Voltage, V
BOOT to PHASE Voltage, V
PHASE Voltage, V
UGATE Voltage, V
LGATE Voltage, V
Input, Output, or I/O Voltage . . . . . . . . . GND - 0.3V to VCC + 0.3V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . Class I JEDEC STD
Recommended Operating Conditions
VCC Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V ±5%
PVCC Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . +5V to 12V ±5%
Ambient Temperature (ISL6322CRZ) . . . . . . . . . . . . . 0°C to +70°C
Ambient Temperature (ISL6322IRZ) . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Stress above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational section of this specification is not implied.
NOTES:
Electrical Specifications
BIAS SUPPLIES
Input Bias Supply Current
Gate Drive Bias Current - PVCC1_2 Pin
Gate Drive Bias Current - PVCC3 Pin
VCC POR (Power-On Reset) Threshold
PVCC POR (Power-On Reset) Threshold
PWM MODULATOR
Oscillator Frequency Accuracy, F
Adjustment Range of Switching Frequency
Oscillator Ramp Amplitude, V
CONTROL THRESHOLDS
ENLL Rising Threshold
ENLL Hysteresis
EN_PH4 Rising Threshold
EN_PH4 Falling Threshold
COMP Shutdown Threshold
1. θ
2. For θ
3. Parameter magnitude guaranteed by design. Not 100% tested.
Tech Brief TB379.
GND - 8V (<400ns, 20µJ) to 24V (<200ns, V
JA
V
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
PHASE
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
GND - 5V (<100ns Pulse Width, 2µJ) to PVCC+ 0.3V
- 3.5V (<100ns Pulse Width, 2µJ) to V
BOOT
LGATE
PHASE
UGATE
PARAMETER
. . . . . . . . . . . . . . GND - 0.3V to GND + 36V
. . . . . . . . V
. . . . . . . . . . . GND - 0.3V to PVCC + 0.3V
. . . . . . . GND - 0.3V to 15V (PVCC = 12)
BOOT-PHASE
PP
7
SW
Recommended Operating Conditions, Unless Otherwise Specified.
PHASE
. . . . . . -0.3V to 15V (DC)
-0.3V to 16V (<10ns, 10µJ)
- 0.3V to V
BOOT-PHASE
I
I
I
VCC rising
VCC falling
PVCC rising
PVCC falling
R
(Note 3)
(Note 3)
COMP falling
VCC
PVCC1_2
PVCC3
BOOT
BOOT
T
= 100kΩ (
; ENLL = high
+ 0.3V
+ 0.3V
= 12V)
; ENLL = high
; ENLL = high
ISL6322
ISL6322
±
0.1%)
TEST CONDITIONS
Thermal Information
Thermal Resistance
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
QFN Package (Notes 1, 2) . . . . . . . . . .
1.160
4.25
3.75
4.25
3.60
1.00
MIN
0.08
225
0.1
15
2
1
1.210
TYP
4.38
3.88
4.38
3.88
1.50
0.85
1.06
250
110
4.3
2.1
0.2
20
θ
JA
(°C/W)
27
1.250
MAX
4.50
4.00
4.50
4.00
1.10
275
1.0
0.3
25
February 15, 2007
6
3
θ
JC
UNITS
FN6328.1
2.5
(°C/W)
MHz
kHz
mA
mA
mV
mA
V
V
V
V
V
V
V
V
V