74LCX573MTC_08 FAIRCHILD [Fairchild Semiconductor], 74LCX573MTC_08 Datasheet

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74LCX573MTC_08

Manufacturer Part Number
74LCX573MTC_08
Description
Low Voltage Octal Latch with 5V Tolerant Inputs and Outputs
Manufacturer
FAIRCHILD [Fairchild Semiconductor]
Datasheet
©2006 Fairchild Semiconductor Corporation
74LCX573 Rev. 1.6.0
74LCX573
Low Voltage Octal Latch with 5V Tolerant
Inputs and Outputs
Features
Note:
1. To ensure the high impedance state during power up
Ordering Information
Note:
2. DQFN package available in Tape and Reel only.
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
74LCX573WM
74LCX573SJ
74LCX573BQX
74LCX573MSA
74LCX573MTC
5V tolerant inputs and outputs
2.3V–3.6V V
7.0 ns t
Power down high impedance inputs and outputs
Supports live insertion/withdrawal
±24mA output drive (V
Implements proprietary noise/EMI reduction circuitry
Latch-up performance exceeds JEDEC 78 conditions
ESD performance
– Human body model
– Machine model
Leadless DQFN package
or down, OE should be tied to V
resistor: the minimum value of the resistor is
determined by the current-sourcing capability of the
driver.
All packages are lead free per JEDEC: J-STD-020B standard.
Number
Order
PD
max. (V
CC
(2)
specifications provided
CC
200V
= 3.3V), 10µA I
Package
Number
MLP20B
CC
MSA20
MTC20
M20B
M20D
2000V
= 3.0V)
CC
(1)
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 4.5mm
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
through a pull-up
CC
max.
General Description
The LCX573 is a high-speed octal latch with buffered
common Latch Enable (LE) and buffered common Out-
put Enable (OE) input.
The LCX573 is functionally identical to the LCX373 but
has inputs and outputs on opposite sides.
The LCX573 is designed for low voltage applications
with capability of interfacing to a 5V signal environment.
The LCX573 is fabricated with an advanced CMOS
tech-
maintaining CMOS low power dissipation.
Package Description
nology to achieve high speed operation while
February 2008
www.fairchildsemi.com

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74LCX573MTC_08 Summary of contents

Page 1

Low Voltage Octal Latch with 5V Tolerant Inputs and Outputs Features 5V tolerant inputs and outputs 2.3V–3.6V V specifications provided CC 7 max 3.3V), 10µ Power down high impedance inputs and outputs ...

Page 2

Connection Diagrams Pin Assignments for SOIC, SOP, SSOP, TSSOP GND 10 Pad Assignments for ...

Page 3

Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure ...

Page 4

DC Electrical Characteristics Symbol Parameter V HIGH Level Input Voltage IH V LOW Level Input Voltage IL V HIGH Level Output OH Voltage V LOW Level Output OL Voltage I Input Leakage Current I I 3-STATE Output Leakage OZ I ...

Page 5

Dynamic Switching Characteristics Symbol Parameter V Quiet Output Dynamic Peak V OLP V Quiet Output Dynamic Valley V OLV Capacitance Symbol Parameter C Input Capacitance IN C Output Capacitance OUT C Power Dissipation Capacitance PD ©2006 Fairchild Semiconductor Corporation 74LCX573 ...

Page 6

AC Loading and Waveforms TEST SIGNAL Figure 1. AC Test Circuit (C DATA IN t pxx DATA OUT Waveform for Inverting and Non-Inverting Functions t W CONTROL IN CLOCK t PHL V OUTPUT mo Propagation Delay, Pulse Width and t ...

Page 7

Schematic Diagram (Generic for LCX Family) Input Stage Data ESD D2 N+/P– Input Stage Enable ESD D4 N+/P– ©2006 Fairchild Semiconductor Corporation 74LCX573 Rev. 1.6 ...

Page 8

Tape and Reel Specification Tape Format for DQFN Package Designator Section BQX Leader (Start End) Trailer (Hub End) Tape Dimensions inches (millimeters) Reel Dimensions inches (millimeters) Tape Size A 12mm 13.0 (330.0) 0.059 (1.50) 0.512 (13.00) 0.795 (20.20) 2.165 (55.00) ...

Page 9

Physical Dimensions 20 B 10.65 7.60 10.00 7.40 1 0.51 PIN ONE 0.35 INDICATOR 2.65 MAX 0.75 0.25 (R0.10) (R0.10) 8° 0° 1.27 0.40 SEATING PLANE (1.40) DETAIL A SCALE: 2:1 Figure 3. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC ...

Page 10

Physical Dimensions (Continued) Figure 4. 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or ...

Page 11

Physical Dimensions (Continued) Figure 5. 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please ...

Page 12

Physical Dimensions (Continued) Figure 6. 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or ...

Page 13

Physical Dimensions (Continued) Figure 7. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision ...

Page 14

TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended exhaustive list of all such trademarks. ® ACEx Build it Now™ CorePLUS™ CROSSVOLT™ CTL™ ...

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