FPF1504 FAIRCHILD [Fairchild Semiconductor], FPF1504 Datasheet - Page 3

• Manufacturer Part Number: FPF1504
• Description: Advanced Load Management Switch
• Manufacturer: FAIRCHILD [Fairchild Semiconductor]

© 2012 Fairchild Semiconductor Corporation
FPF1504 • Rev. 1.0.0
Physical Dimensions
Product-Specific Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
FPF1504UCX
PIN A1 AREA
Product
2X
0.05 C
0.03 C
0.50
0.50
BOTTOM VIEW
C
TOP VIEW
Figure 25. 4-Ball, 1.0 x 1.0mm Wafer-Level Chip Scale (WLCSP) Packaging
D
1 2
E
960µm ±30µm
SEATING PLANE
B
A
(X)±0.018
A
Ø0.315±0.025
4X
0.625
0.539
D
D
B
(Y)±0.018
2X
0.005
F
0.06 C
0.03 C
F
C A B
SIDE VIEWS
960µm ±30µm
NOTES:
E
9
B. DIMENSIONS ARE IN MILLIMETERS.
D. DATUM C IS DEFINED BY THE SPHERICAL
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
F. FOR DIMENSIONS D, E, X, AND Y SEE
C. DIMENSIONS AND TOLERANCES PER
G. DRAWING FILENAME: MKT-UC004ABrev2.
A. NO JEDEC REGISTRATION APPLIES.
RECOMMENDED LAND PATTERN
ASME Y14.5M, 1994.
CROWNS OF THE BALLS.
±43 MICRONS (539-625 MICRONS).
PRODUCT DATASHEET.
(NSMD PAD TYPE)
0.50
0.50
0.230mm
X
(Ø0.350)
Solder Mask
(Ø0.250)
Cu Pad
0.332±0.018
0.250±0.025
0.230mm
www.fairchildsemi.com
Y