FAN2103_08 FAIRCHILD [Fairchild Semiconductor], FAN2103_08 Datasheet - Page 13

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FAN2103_08

Manufacturer Part Number
FAN2103_08
Description
Manufacturer
FAIRCHILD [Fairchild Semiconductor]
Datasheet
© 2007 Fairchild Semiconductor Corporation
FAN2103 Rev. 1.0.5
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
2X
SEATING
PLANE
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Figure 26. 5x6mm Molded Leadless Package (MLP)
2X
13
ALL VALUES TYPICAL EXCEPT WHERE NOTED
C) DIMENSIONS DO NOT INCLUDE MOLD
B) DIMENSIONS AND TOLERANCES PER
A) DIMENSIONS ARE IN MILLIMETERS.
D) DESIGN BASED ON JEDEC MO-220
E) TERMINALS ARE SYMMETRICAL AROUND THE
F) DRAWING FILENAME: MKT-MLP25AREV2
RECOMMENDED LAND PATTERN
FLASH OR BURRS.
ASME Y14.5M, 1994
X & Y AXIS EXCEPT WHERE DEPOPULATED.
VARIATION WJHC
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