MC9S12DG256C FREESCALE [Freescale Semiconductor, Inc], MC9S12DG256C Datasheet - Page 123

• Manufacturer Part Number: MC9S12DG256C
• Description: device made up of standard HCS12 blocks and the HCS12 processor core
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

B.3 80-pin QFP package
SEATING
PLANE
DATUM
PLANE
-C-
L
-A-
C
-H-
E
H
61
80
Figure B-2 80-pin QFP Mechanical Dimensions (case no. 841B)
60
DETAIL C
1
G
0.20
0.05 A-B
0.20
W
M
M
X
Freescale Semiconductor, Inc.
H
C
K
For More Information On This Product,
A
S
L
A-B
A-B
DETAIL A
U
R
-D-
T
S
S
D
D
Q
Go to: www.freescale.com
S
S
M
M
20
NOTES:
41
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
4. DATUMS -A-, -B- AND -D- TO BE
5. DIMENSIONS S AND V TO BE DETERMINED
6. DIMENSIONS A AND B DO NOT INCLUDE
7. DIMENSION D DOES NOT INCLUDE DAMBAR
ANSI Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING LINE.
DETERMINED AT DATUM PLANE -H-.
AT SEATING PLANE -C-.
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE -H-.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR
THE FOOT.
40
21
-B-
MC9S12DP256B Device User Guide — V02.15
B
DETAIL C
-H-
0.10
DATUM
PLANE
V
J
0.20
SECTION B-B
VIEW ROTATED 90
DETAIL A
B
B
M
C
DIM
G
M
Q
W
F
D
A
B
C
D
E
F
H
J
K
L
N
P
R
S
T
U
V
X
A-B
13.90
13.90
16.95
16.95
MILLIMETERS
MIN
2.15
0.22
2.00
0.22
0.13
0.65
0.13
0.13
0.13
0.35
12.35 REF
0.325 BSC
0.65 BSC
---
5
0
0
1.6 REF
S
-A-,-B-,-D-
14.10
14.10
17.45
17.45
N
MAX
D
2.45
0.38
2.40
0.33
0.25
0.23
0.95
0.17
0.30
0.45
P
10
7
---
---
S
125