MC9S12DG256C FREESCALE [Freescale Semiconductor, Inc], MC9S12DG256C Datasheet - Page 90

• Manufacturer Part Number: MC9S12DG256C
• Description: device made up of standard HCS12 blocks and the HCS12 processor core
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

MC9S12DP256B Device User Guide — V02.15
The total power dissipation can be calculated from:
Two cases with internal voltage regulator enabled and disabled must be considered:
T J
T A
P D
P INT
JA
1. Internal Voltage Regulator disabled
2. Internal voltage regulator enabled
92
P
For R
respectively
I
additionally contains the current flowing into the external loads with output high.
P
=
DDR
=
=
IO
IO
=
Junction Temperature, [ C
Ambient Temperature, [ C
=
Total Chip Power Dissipation, [W]
is the sum of all output currents on I/O ports associated with VDDX and VDDR.
is the sum of all output currents on I/O ports associated with VDDX and VDDR.
Package Thermal Resistance, [ C/W]
DSON
is the current shown in Table A-7 and not the overall current flowing into VDDR, which
Chip Internal Power Dissipation, [W]
is valid:
P
INT
R DSON
=
Freescale Semiconductor, Inc.
I
P INT
R DSON
DD
For More Information On This Product,
=
V
P
=
P
DD
V
----------------------------------- - for outputs driven high
IO
IO
T
I DDR V DDR
Go to: www.freescale.com
DD5
J
=
P D
+
=
=
=
I OH
V
----------- - for outputs driven low
I OL
I
DDPLL
OL
T
–
=
i
i
A
V
P INT
;
R
OH
R
+
DSON
DSON
P
;
D
V
+
+
DDPLL
P IO
I DDA V DDA
JA
I IO
I
IO i
i
2
2
+
I
DDA
V
DDA