MK40DN512VMD10 Freescale Semiconductor, MK40DN512VMD10 Datasheet - Page 36

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MK40DN512VMD10

Manufacturer Part Number
MK40DN512VMD10
Description
ARM Microcontrollers - MCU KINETIS 512K USB LCD
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MK40DN512VMD10

Rohs
yes
Core
ARM Cortex M4
Processor Series
K40
Data Bus Width
32 bit
Maximum Clock Frequency
100 MHz
Program Memory Size
512 KB
Data Ram Size
128 KB
On-chip Adc
Yes
Operating Supply Voltage
1.71 V to 3.6 V
Operating Temperature Range
- 40 C to + 105 C
Package / Case
MAPBGA-144
Mounting Style
SMD/SMT

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
MK40DN512VMD10
Manufacturer:
Freescale Semiconductor
Quantity:
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Part Number:
MK40DN512VMD10
Quantity:
111
Peripheral operating requirements and behaviors
While different partitions of the FlexNVM are available, the intention is that a single
choice for the FlexNVM partition code and EEPROM data set size is used throughout the
entire lifetime of a given application. The EEPROM endurance equation and graph
shown below assume that only one configuration is ever used.
Writes_subsystem =
where
36
• Writes_subsystem — minimum number of writes to each FlexRAM location for
• EEPROM — allocated FlexNVM for each EEPROM subsystem based on DEPART;
• EEESPLIT — FlexRAM split factor for subsystem; entered with the Program
• EEESIZE — allocated FlexRAM based on DEPART; entered with the Program
• Write_efficiency —
• n
subsystem (each subsystem can have different endurance)
entered with the Program Partition command
Partition command
Partition command
cycles)
nvmcycd
• 0.25 for 8-bit writes to FlexRAM
• 0.50 for 16-bit or 32-bit writes to FlexRAM
— data flash cycling endurance (the following graph assumes 10,000
EEPROM – 2 × EEESPLIT × EEESIZE
K40 Sub-Family Data Sheet, Rev. 2, 12/2012.
EEESPLIT × EEESIZE
× Write_efficiency × n
Freescale Semiconductor, Inc.
nvmcycd

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