AD9683-170EBZ Analog Devices, AD9683-170EBZ Datasheet - Page 10

• Manufacturer Part Number: AD9683-170EBZ
• Description: Data Conversion IC Development Tools
• Manufacturer: Analog Devices
• Type: ADCr
• Series: AD9683r

Specifications of AD9683-170EBZ

• Rohs: yes
• Product: Evaluation Boards
• Tool Is For Evaluation Of: AD9683-170
• Interface Type: SPI
• Operating Supply Voltage: 1.8 V
• Description/function: Evaluation board with AD9683-170
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Current: 135 mA
• For Use With: AD9683-170

AD9683
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Electrical
Environmental
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AVDD to AGND
DRVDD to DRGND
DVDD to DGND
VIN+, VIN− to AGND
CLK+, CLK− to AGND
RFCLK to AGND
VCM to AGND
CS, PDWN to DGND
SCLK to DGND
SDIO to DGND
RST to DGND
FD to DGND
SERDOUT0+, SERDOUT0− to AGND
SYNCINB+, SYNCINB− to DGND
SYSREF+, SYSREF− to AGND
Operating Temperature Range
Maximum Junction Temperature
Storage Temperature Range
(Ambient)
Under Bias
(Ambient)
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
−40°C to +85°C
150°C
−65°C to +125°C
Rev. 0 | Page 10 of 44
THERMAL CHARACTERISTICS
The exposed pad must be soldered to the ground plane of the
LFCSP package. This increases the reliability of the solder
joints, maximizing the thermal capability of the package.
Table 7. Thermal Resistance
Package Type
32-Lead LFCSP
1
2
3
4
5
Typical θ
with a solid ground plane. As shown in Table 7, airflow increases
heat dissipation, which reduces θ
contact with the package leads from metal traces, through holes,
ground, and power planes reduces the θ
ESD CAUTION
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
Per MIL-STD-883, Method 1012.1.
Per JEDEC JESD51-8 (still air).
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
N/A = not applicable.
5 mm × 5 mm
(CP-32-12)
JA
is specified for a 4-layer printed circuit board (PCB)
Airflow
Velocity
(m/sec)
0
1.0
2.5
θ
37.1
32.4
29.1
JA
JA
1, 2
. In addition, metal in direct
θ
3.1
N/A
N/A
JA
JC
.
1, 3, 4
Data Sheet
θ
20.7
N/A
N/A
JB
1, 4, 5
Unit
°C/W
°C/W
°C/W