BUK9608-55B /T3 NXP Semiconductors, BUK9608-55B /T3 Datasheet - Page 4

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BUK9608-55B /T3

Manufacturer Part Number
BUK9608-55B /T3
Description
MOSFET HIGH PERF TRENCHMOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK9608-55B /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
55 V
Gate-source Breakdown Voltage
15 V
Continuous Drain Current
110 A
Resistance Drain-source Rds (on)
0.007 Ohms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
SOT-404
Fall Time
86 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
203 W
Rise Time
123 ns
Factory Pack Quantity
800
Typical Turn-off Delay Time
131 ns
Part # Aliases
BUK9608-55B,118
NXP Semiconductors
BUK9608-55B
Product data sheet
Fig 1.
Fig 3.
(A)
I D
120
80
40
0
mounting base temperature
Continuous drain current as a function of
Safe operating area; continuous and peak drain currents as a function of drain-source voltage
0
50
(A)
I
D
10
10
10
Capped at 75 A due to package
1
3
2
1
Capped at 75 A due to package
Limit R
100
DSon
= V
150
DS
/I
All information provided in this document is subject to legal disclaimers.
T
D
mb
03nn57
(°C)
200
Rev. 04 — 4 May 2010
10
Fig 2.
DC
P
(%)
der
120
80
40
0
function of mounting base temperature
Normalized total power dissipation as a
0
V
DS
N-channel TrenchMOS logic level FET
(V)
50
t
100 μ s
1 ms
10 ms
100 ms
p
BUK9608-55B
= 10 μ s
100
03nn55
10
2
150
© NXP B.V. 2010. All rights reserved.
T
mb
03na19
(°C)
200
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