PCF2113DH/4,557 NXP Semiconductors, PCF2113DH/4,557 Datasheet - Page 60

• Manufacturer Part Number: PCF2113DH/4,557
• Description: IC LCD CONTROLLER/DRIVER 100LQFP
• Manufacturer: NXP Semiconductors

Specifications of PCF2113DH/4,557

• Package / Case: 100-LQFP
• Display Type: LCD
• Configuration: 5 X 8 (Matrix)
• Interface: I²C
• Voltage - Supply: 2.2 V ~ 4 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Digits: 40
• Maximum Clock Frequency: 450 KHz
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Power Dissipation: 400 mW
• Maximum Operating Temperature: + 75 C
• Attached Touch Screen: No
• Maximum Supply Current: 50 mA
• Minimum Operating Temperature: - 20 C
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Package Type: LQFP
• Pin Count: 100
• Mounting: Surface Mount
• Power Dissipation: 400mW
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (max): 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Digits Or Characters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935276328557; PCF2113DH/4; PCF2113DH/4

NXP Semiconductors
PCF2113_FAM_4
Product data sheet
20.3 Wave soldering
20.4 Reflow soldering
Key characteristics in both wave and reflow soldering are:
Key characteristics in wave soldering are:
Key characteristics in reflow soldering are:
Table 29.
Package thickness (mm)
< 2.5
•
•
•
•
•
•
•
•
•
•
•
2.5
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 29
SnPb eutectic process (from J-STD-020C)
and
30
Rev. 04 — 4 March 2008
Package reflow temperature ( C)
Volume (mm
< 350
235
220
3
)
Figure
42) than a SnPb process, thus
220
220
350
LCD controllers/drivers
PCF2113x
© NXP B.V. 2008. All rights reserved.
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