IR3503MTRPBF International Rectifier, IR3503MTRPBF Datasheet - Page 35

• Manufacturer Part Number: IR3503MTRPBF
• Description: IC CTRL XPHASE VR11.0/1 32-MLPQ
• Manufacturer: International Rectifier
• Series: XPhase3™r

Specifications of IR3503MTRPBF

• Applications: Processor
• Current - Supply: 8mA
• Voltage - Supply: 4.75 V ~ 7.5 V
• Operating Temperature: 0°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: *
• Package: 32-Lead MLPQ
• Circuit: X-Phase Control IC
• Switch Freq (khz): 250kHz to 1.5MHz
• Pbf: PbF Option Available
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: IR3503MTRPBFTR

Layout Guidelines
The following layout guidelines are recommended to reduce the parasitic inductance and resistance of the PCB
layout, therefore minimizing the noise coupled to the IC.
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Dedicate at least one middle layer for a ground plane LGND.
Since, the centre pad under the IC is the LGND, connect it to the ground plane through at least 4 vias to reduce
the routing lengths for components around the control IC
Connect the ground tab under the control IC to LGND plane through a via.
Place VCCL decoupling capacitor VCCL as close as possible to VCCL and LGND pins.
Place the following critical components on the same layer as control IC and position them as close as possible
to the respective pins, R
Place the compensation components on the same layer as control IC and position them as close as possible to
EAOUT, FB, VO and VDRP pins. Avoid using any via for the connection.
Use Kelvin connections for the remote voltage sense signals, VOSNS+ and VOSNS-, and avoid crossing over
the fast transition nodes, i.e. switching nodes, gate drive signals and bootstrap nodes.
Avoid analog control bus signals, VDAC, IIN, and especially EAOUT, crossing over the fast transition nodes.
Separate digital bus, CLKOUT, PHSIN and PHSOUT from the analog control bus and other compensation
components.
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OSC
, R
VDAC
, C
VDAC
, and C
SS/DEL
. Avoid using any via for the connection.
February 12, 2010
IR3503