ISL6552CB Intersil, ISL6552CB Datasheet - Page 7

• Manufacturer Part Number: ISL6552CB
• Description: IC PWM CORE VOLTAGE REG 20-SOIC
• Manufacturer: Intersil

Specifications of ISL6552CB

• Pwm Type: Controller
• Number Of Outputs: 1
• Frequency - Max: 1.5MHz
• Voltage - Supply: 4.75 V ~ 5.25 V
• Buck: Yes
• Boost: No
• Flyback: No
• Inverting: No
• Doubler: No
• Divider: No
• Cuk: No
• Isolated: No
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 20-SOIC (7.5mm Width)
• Frequency-max: 1.5MHz
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Duty Cycle: -

Absolute Maximum Ratings
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+7V
Input, Output, or I/O Voltage . . . . . . . . . . GND -0.3V to VCC + 0.3V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5KV
Recommended Operating Conditions
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V ±5%
Ambient Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . 0
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Electrical Specifications
1. θ
2. θ
3. For θ
INPUT SUPPLY POWER
Input Supply Current
POR (Power-On Reset) Threshold
REFERENCE AND DAC
DAC Voltage Accuracy
DAC Pin Input Low Voltage Threshold
DAC Pin Input High Voltage Threshold
VID Pull-Up
OSCILLATOR
Frequency, F
Adjustment Range
Disable Voltage
ERROR AMPLIFIER
DC Gain
Gain-Bandwidth Product
Slew Rate
Maximum Output Voltage
Minimum Output Voltage
ISEN
Full Scale Input Current
Over-Current Trip Level
POWER GOOD MONITOR
Under-Voltage Threshold
Under-Voltage Threshold
PGOOD Low Output Voltage
PROTECTION
Over-Voltage Threshold
Percent Over-Voltage Hysteresis
Tech Brief TB379.
JA
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
SW
PARAMETER
7
Operating Conditions: VCC = 5V, T
R
VCC Rising
VCC Falling
R
(See Figure 10)
Maximum voltage at FS/DIS to disable controller. I
R
C
C
R
R
VSEN Rising
I
VSEN Rising
VIDx = 0V or VIDx = 3V
VSEN Falling
VSEN Falling after Over-Voltage
PGOOD
T
T
L
L
L
L
L
= 100kΩ
= 100kΩ, ±1%
= 10K to ground
= 100pF, R
= 100pF, R
= 10K to ground
= 10K to ground
= 4mA
o
C to 70
L
L
= 10K to ground
= 10K to ground
o
C
ISL6552
TEST CONDITIONS
A
= 0
o
C to 70
Thermal Information
Thermal Resistance
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150
Maximum Storage Temperature Range . . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300
SOIC Package (Note 1) . . . . . . . . . . . .
QFN Package (Notes 2, 3) . . . . . . . . . .
(SOIC - Lead Tips Only)
o
C, Unless Otherwise Specified
FS/DIS
= 1mA.
MIN
4.25
3.75
0.05
1.12
224
2.0
3.6
10
-1
-
-
-
-
-
-
-
-
-
-
-
-
-
θ
JA
TYP
4.38
3.88
0.16
82.5
0.92
0.90
0.18
1.15
280
1.2
5.3
4.1
10
20
72
18
50
2
-
-
-
-
(
65
33
o
C/W) θ
MAX UNITS
4.00
336
4.5
0.8
1.5
1.0
0.5
0.4
1.2
15
40
1
-
-
-
-
-
-
-
-
-
-
o
C to 150
JC
NA
4.5
(
V
V
V
MHz
MHz
V/µs
o
kHz
mA
µA
dB
µA
µA
DAC
DAC
DAC
%
%
C/W)
V
V
V
V
V
V
V
V
o
o
o
C
C
C