BD9778F-E2 Rohm Semiconductor, BD9778F-E2 Datasheet - Page 15

• Manufacturer Part Number: BD9778F-E2
• Description: IC REG SW 2A P-CH MOSF STDN SOP8
• Manufacturer: Rohm Semiconductor
• Type: Step-Down (Buck)r

Specifications of BD9778F-E2

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 1 ~ 35 V
• Current - Output: 2A
• Frequency - Switching: 50kHz ~ 500kHz
• Voltage - Input: 7 ~ 35 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOP
• Power - Output: 690mW
• No. Of Outputs: 1
• Output Voltage: 35V
• Output Current: 2A
• Voltage Regulator Case Style: SOP
• No. Of Pins: 8
• Operating Temperature Range: -40°C To +125°C
• Svhc: No SVHC (18-Jun-2010)
• Base Number: 9778
• Input Voltage: 35 V
• Switching Frequency: 102 KHz
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: BD9778F-E2TR

10
9
8
7
6
5
4
3
2
1
0
8. Ground wiring pattern
9. Temperature protection (thermal shut down) circuit
10. On the application shown below, if there is a mode in which V
Thermal derating characteristics
HRP7
It is recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single
ground at the reference point of the set PCB, so that resistance to the wiring pattern and voltage fluctuations due to
a large current will cause no fluctuations in voltages of the small-signal GND. Prevent fluctuations in the GND wiring pattern
of external parts.
This IC has a built-in temperature protection circuit to prevent the thermal destruction of the IC. As described above,
be sure to use this IC within the power dissipation range. Should a condition exceeding the power dissipation range continue,
the chip temperature Tj will rise to activate the temperature protection circuit, thus turning OFF the output power element.
Then, when the tip temperature Tj falls, the circuit will be automatically reset. Furthermore, if the temperature protection
circuit is activated under the condition exceeding the absolute maximum ratings, do not attempt to use the temperature
protection circuit for set design.
if the V
it is recommended to insert a backflow prevention diode in the series with V
7.3W
5.5W
2.3W
1.4W
Single piece of IC
PCB size: 70 x 70 x 1.6 mm
Copper foil area on the front side of PCB: 10.5 x 10.5 mm
2-layer PCB (Copper foil area on the reverse side of PCB: 15 x 15 mm
2-layer PCB (Copper foil area on the reverse side of PCB: 70 x 70 mm
4-layer PCB (Copper foil area on the reverse side of PCB: 70 x 70 mm
25
IN
AMBIENT TEMPERATURE Ta
is short-circuited to the Ground with external diode charged, internal circuits may be damaged. To avoid damage,
50
3
(PCB incorporates thermal via.)
75
Fig.39
100
125
2
Backflow prevention diode
Bypass diode
2
2
2
150
)
)
)
Fig.35
15/16
Vcc
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
IN
0
and each pin potential are inverted, for example,
0
SOP8
Pin
Single piece of IC
When mounted on ROHM standard PCB
(Glass epoxy PCB of 70 mm x 70 mm x 1.6 mm)
25
AMBIENT TEMPERATURE Ta
IN
or a bypass diode between each pin and V
50
BD9001F
75
Fig.40
100
125
BD9778F
150
IN
.