ST72F324LJ2T5 STMicroelectronics, ST72F324LJ2T5 Datasheet - Page 121
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ST72F324LJ2T5
Manufacturer Part Number
ST72F324LJ2T5
Description
IC MCU 8BIT 8K FLASH 44-LQFP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet
1.ST72F324LJ2T5.pdf
(154 pages)
Specifications of ST72F324LJ2T5
Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
32
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
2.85 V ~ 3.6 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-10°C ~ 85°C
Package / Case
44-LQFP
Processor Series
ST72F3x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
384 B
Interface Type
SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
32
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7232X-EVAL, ST7MDT20-DVP3, ST7MDT20J-EMU3, STX-RLINK
Minimum Operating Temperature
- 10 C
On-chip Adc
10 bit, 12 Channel
For Use With
497-6421 - BOARD EVAL DGTL BATT CHGR DESIGN497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
497-8242
ST72F324LJ2T5
ST72F324LJ2T5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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Manufacturer:
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Quantity:
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Part Number:
ST72F324LJ2T5
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12.7 EMC CHARACTERISTICS
Susceptibility tests are performed on a sample ba-
sis during product characterization.
12.7.1 Functional EMS (Electro Magnetic
Susceptibility)
Based on a simple running application on the
product (toggling 2 LEDs through I/O ports), the
product is stressed by two electro magnetic events
until a failure occurs (indicated by the LEDs).
■
■
A device reset allows normal operations to be re-
sumed. The test results are given in the table be-
low based on the EMS levels and classes defined
in application note AN1709.
12.7.1.1 Designing hardened software to avoid
noise problems
EMC characterization and optimization are per-
formed at component level with a typical applica-
Symbol
ESD: Electro-Static Discharge (positive and
negative) is applied on all pins of the device until
a functional disturbance occurs. This test
conforms with the IEC 1000-4-2 standard.
FTB: A Burst of Fast Transient voltage (positive
and negative) is applied to V
a 100pF capacitor, until a functional disturbance
occurs. This test conforms with the IEC 1000-4-
4 standard.
V
V
FESD
FFTB
Voltage limits to be applied on any I/O
pin to induce a functional disturbance
Fast transient voltage burst limits to be
applied through 100pF on V
pins to induce a functional disturbance
Parameter
DD
and V
DD
and V
SS
through
DD
V
conforms to IEC 1000-4-2
V
conforms to IEC 1000-4-4
DD
DD
=3.3V, T
=3.3V, T
tion environment and simplified MCU software. It
should be noted that good EMC performance is
highly dependent on the user application and the
software in particular.
Therefore it is recommended that the user applies
EMC software optimization and prequalification
tests in relation with the EMC level requested for
his application.
Software recommendations:
The software flowchart must include the manage-
ment of runaway conditions such as:
– Corrupted program counter
– Unexpected reset
– Critical Data corruption (control registers...)
Prequalification trials:
Most of the common failures (unexpected reset
and program counter corruption) can be repro-
duced by manually forcing a low state on the RE-
SET pin or the Oscillator pins for 1 second.
To complete these trials, ESD stress can be ap-
plied directly on the device, over the range of
specification values. When unexpected behaviour
is detected, the software can be hardened to pre-
vent unrecoverable errors occurring (see applica-
tion note AN1015).
A
A
=+25°C, f
=+25°C, f
Conditions
OSC
OSC
=8MHz
=8MHz
ST72324Lxx
Flash
Level/Class
3B
4A
121/154
ROM
4B
4A
1