MC9S08JM60CGT Freescale Semiconductor, MC9S08JM60CGT Datasheet - Page 22

• Manufacturer Part Number: MC9S08JM60CGT
• Description: IC MCU 8BIT 60K FLASH 48-QFN
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08JM60CGT

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, LIN, SCI, SPI, USB
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 37
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-QFN
• Processor Series: S08JM
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 24 MHz
• Number Of Programmable I/os: 37
• Number Of Timers: 8
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMOJM, DEMOJMSKT, DEMOFLEXISJMSD, DEMO9S08JM16
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 12-bit
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 24MHz
• Total Internal Ram Size: 4KB
• # I/os (max): 37
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: QFN EP
• Package: 48QFN EP
• Family Name: HCS08
• Maximum Speed: 24 MHz
• Operating Supply Voltage: 3.3|5 V
• For Use With: DEMOJM - KIT DEMO FOR JM MCU FAMILYDEMOJMSKT - BOARD DEMO S08JM CARD W/SOCKET
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

EXTAL
Chapter 1 Device Overview
The MCG supplies the following clock sources:
22
1. The FFCLK is internally synchronized to the bus clock and must not exceed one half of the bus clock frequency.
2. ADC has min. and max. frequency requirements. See
and
3. Flash has the frequency requirements for program and erase operation. See the
details.
MCG
XOSC
•
•
•
•
1 kHz
LPO
Appendix A, “Electrical
XTAL
MCGOUT — This clock source is used as the CPU, USB RAM and USB module clock, and is
divided by two to generate the peripheral bus clock (BUSCLK). Control bits in the MCG control
registers determine which of the three clock sources is connected:
— Internal reference clock
— External reference clock
— Frequency-locked loop (FLL) or Phase-locked loop (PLL) output
See
MCGOUT clock.
MCGLCLK — This clock source is derived from the digitally controlled oscillator (DCO) of the
MCG. Development tools can select this internal self-clocked source to speed up BDC
communications in systems where the bus clock is slow.
MCGIRCLK — This is the internal reference clock and can be selected as the real-time counter
clock source.
MCGIRCLK in more detail. See
information regarding the use of MCGIRCLK.
MCGERCLK — This is the external reference clock and can be selected as the clock source of
real-time counter and ADC module.
MCGERCLK in more detail. See
Chapter 12, “Multi-Purpose Clock Generator
MCGERCLK
MCGFFCLK
MCGIRCLK
LPO clock
MCGOUT
MCGLCLK
USB RAM
Chapter 12, “Multi-Purpose Clock Generator
÷
÷
Characteristics,” for details.
USB
2
2
BUSCLK
Figure 1-2. System Clock Distribution Diagram
RTC
CPU
MC9S08JM60 Series Data Sheet, Rev. 3
COP
TPMCLK
Chapter 13, “Real-Time Counter
Chapter 13, “Real-Time Counter
BDC
Section 12.4.6, “External Reference
TPM1
Chapter 10, “Analog-to-Digital Converter
FFCLK
1
TPM2
(S08MCGV1),” for details on configuring the
IIC
(S08MCGV1),” explains the
Appendix A, “Electrical
ADC
2
(S08RTCV1),” and
SCI1
(S08RTCV1),” for more
RAM
Clock,” explains the
(S08ADC12V1),”
SCI2
Freescale Semiconductor
Characteristics,” for
Flash
SPI1
Chapter 10,
3
SPI2