MC9S08JM60CGT Freescale Semiconductor, MC9S08JM60CGT Datasheet - Page 327

• Manufacturer Part Number: MC9S08JM60CGT
• Description: IC MCU 8BIT 60K FLASH 48-QFN
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08JM60CGT

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, LIN, SCI, SPI, USB
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 37
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-QFN
• Processor Series: S08JM
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 24 MHz
• Number Of Programmable I/os: 37
• Number Of Timers: 8
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMOJM, DEMOJMSKT, DEMOFLEXISJMSD, DEMO9S08JM16
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 12-bit
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 24MHz
• Total Internal Ram Size: 4KB
• # I/os (max): 37
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: QFN EP
• Package: 48QFN EP
• Family Name: HCS08
• Maximum Speed: 24 MHz
• Operating Supply Voltage: 3.3|5 V
• For Use With: DEMOJM - KIT DEMO FOR JM MCU FAMILYDEMOJMSKT - BOARD DEMO S08JM CARD W/SOCKET
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Chapter 18
Development Support
18.1
Introduction
Development support systems in the HCS08 include the background debug controller (BDC) and the
on-chip debug module (DBG). The BDC provides a single-wire debug interface to the target MCU that
provides a convenient interface for programming the on-chip flash and other nonvolatile memories. The
BDC is also the primary debug interface for development and allows non-intrusive access to memory data
and traditional debug features such as CPU register modify, breakpoints, and single instruction trace
commands.
In the HCS08 family, address and data bus signals are not available on external pins (not even in test
modes). Debug is done through commands fed into the target MCU via the single-wire background debug
interface. The debug module provides a means to selectively trigger and capture bus information so an
external development system can reconstruct what happened inside the MCU on a cycle-by-cycle basis
without having external access to the address and data signals.
The alternate BDC clock source for MC9S08JM60 Series is the MCGLCLK. See
Chapter 12,
“Multi-Purpose Clock Generator
(S08MCGV1),” for more information about MCGLCLK and how to
select clock sources.
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor
327