MC9S08JM60CGT Freescale Semiconductor, MC9S08JM60CGT Datasheet - Page 68
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MC9S08JM60CGT
Manufacturer Part Number
MC9S08JM60CGT
Description
IC MCU 8BIT 60K FLASH 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.MC9S08JM32CLD.pdf
(388 pages)
Specifications of MC9S08JM60CGT
Core Processor
HCS08
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, LIN, SCI, SPI, USB
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
37
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
48-QFN
Processor Series
S08JM
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
4 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
37
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMOJM, DEMOJMSKT, DEMOFLEXISJMSD, DEMO9S08JM16
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 12-bit
Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
24MHz
Total Internal Ram Size
4KB
# I/os (max)
37
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Package Type
QFN EP
Package
48QFN EP
Family Name
HCS08
Maximum Speed
24 MHz
Operating Supply Voltage
3.3|5 V
For Use With
DEMOJM - KIT DEMO FOR JM MCU FAMILYDEMOJMSKT - BOARD DEMO S08JM CARD W/SOCKET
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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Chapter 5 Resets, Interrupts, and System Configuration
5.5.1
Figure 5-1
(SP) points at the next available byte location on the stack. The current values of CPU registers are stored
on the stack starting with the low-order byte of the program counter (PCL) and ending with the CCR. After
stacking, the SP points at the next available location on the stack which is the address that is one less than
the address where the CCR was saved. The PC value that is stacked is the address of the instruction in the
main program that would have executed next if the interrupt had not occurred.
When an RTI instruction is executed, these values are recovered from the stack in reverse order. As part
of the RTI sequence, the CPU fills the instruction pipeline by reading three bytes of program information,
starting from the PC address recovered from the stack.
The status flag causing the interrupt must be acknowledged (cleared) before returning from the ISR.
Typically, the flag must be cleared at the beginning of the ISR so that if another interrupt is generated by
this same source, it will be registered so it can be serviced after completion of the current ISR.
5.5.2
External interrupts are managed by the IRQSC status and control register. When the IRQ function is
enabled, synchronous logic monitors the pin for edge-only or edge-and-level events. When the MCU is in
stop mode and system clocks are shut down, a separate asynchronous path is used so the IRQ (if enabled)
can wake the MCU.
5.5.2.1
The IRQ pin enable (IRQPE) control bit in IRQSC must be 1 in order for the IRQ pin to act as the interrupt
request (IRQ) input. As an IRQ input, the user can choose the polarity of edges or levels detected
(IRQEDG), whether the pin detects edges-only or edges and levels (IRQMOD), and whether an event
causes an interrupt or only sets the IRQF flag which can be polled by software.
68
shows the contents and organization of a stack frame. Before the interrupt, the stack pointer
Interrupt Stack Frame
External Interrupt Request (IRQ) Pin
Pin Configuration Options
STACKING
ORDER
UNSTACKING
5
4
3
2
1
ORDER
1
2
3
4
5
* High byte (H) of index register is not automatically stacked.
7
INDEX REGISTER (LOW BYTE X)
MC9S08JM60 Series Data Sheet, Rev. 3
Figure 5-1. Interrupt Stack Frame
CONDITION CODE REGISTER
PROGRAM COUNTER HIGH
PROGRAM COUNTER LOW
ACCUMULATOR
TOWARD HIGHER ADDRESSES
TOWARD LOWER ADDRESSES
*
0
SP AFTER
INTERRUPT STACKING
SP BEFORE
THE INTERRUPT
Freescale Semiconductor
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