AT91SAM9260B-QU Atmel, AT91SAM9260B-QU Datasheet - Page 220

IC ARM9 MCU 208-PQFP

AT91SAM9260B-QU

Manufacturer Part Number
AT91SAM9260B-QU
Description
IC ARM9 MCU 208-PQFP
Manufacturer
Atmel
Series
AT91SAMr
Datasheets

Specifications of AT91SAM9260B-QU

Core Processor
ARM9
Core Size
16/32-Bit
Speed
180MHz
Connectivity
EBI/EMI, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
POR, WDT
Number Of I /o
96
Program Memory Size
32KB (32K x 8)
Program Memory Type
ROM
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
208-MQFP, 208-PQFP
Package
208PQFP
Device Core
ARM926EJ-S
Family Name
91S
Maximum Speed
180 MHz
Operating Supply Voltage
1.8|3.3 V
Data Bus Width
32 Bit
Number Of Programmable I/os
96
Interface Type
EBI/Ethernet/SPI/TWI/UART/USART/USB
On-chip Adc
4-chx10-bit
Number Of Timers
6
Processor Series
AT91SAMx
Core
ARM926EJ-S
Data Ram Size
8 KB
Maximum Clock Frequency
180 MHz
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91SAM-ICE, AT91-ISP, AT91SAM9260-EK
Minimum Operating Temperature
- 40 C
Cpu Family
AT91
Device Core Size
32b
Frequency (max)
180MHz
Total Internal Ram Size
8KB
# I/os (max)
96
Number Of Timers - General Purpose
6
Operating Supply Voltage (typ)
1.8/3.3V
Operating Supply Voltage (max)
1.95/3.6V
Operating Supply Voltage (min)
1.65/3V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
208
Package Type
PQFP
For Use With
AT91SAM9260-EK - KIT EVAL FOR AT91SAM9260AT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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21.6.4
Register Name:
Access Type:
Reset Value:
• LPCB: Low-power Configuration Bits
• PASR: Partial Array Self-refresh (only for low-power SDRAM)
PASR parameter is transmitted to the SDRAM during initialization to specify whether only one quarter, one half or all banks
of the SDRAM array are enabled. Disabled banks are not refreshed in self-refresh mode. This parameter must be set
according to the SDRAM device specification.
• TCSR: Temperature Compensated Self-Refresh (only for low-power SDRAM)
TCSR parameter is transmitted to the SDRAM during initialization to set the refresh interval during self-refresh mode
depending on the temperature of the low-power SDRAM. This parameter must be set according to the SDRAM device
specification.
• DS: Drive Strength (only for low-power SDRAM)
DS parameter is transmitted to the SDRAM during initialization to select the SDRAM strength of data output. This parame-
ter must be set according to the SDRAM device specification.
6221I–ATARM–17-Jul-09
00
01
10
11
31
23
15
7
SDRAMC Low Power Register
Low Power Feature is inhibited: no Power-down, Self-refresh or Deep Power-down command is issued to
the SDRAM device.
The SDRAM Controller issues a Self-refresh command to the SDRAM device, the SDCLK clock is
deactivated and the SDCKE signal is set low. The SDRAM device leaves the Self Refresh Mode when
accessed and enters it after the access.
The SDRAM Controller issues a Power-down Command to the SDRAM device after each access, the
SDCKE signal is set to low. The SDRAM device leaves the Power-down Mode when accessed and
enters it after the access.
The SDRAM Controller issues a Deep Power-down command to the SDRAM device. This mode is
unique to low-power SDRAM.
30
22
14
SDRAMC_LPR
Read-write
0x0
6
PASR
29
21
13
5
TIMEOUT
28
20
12
4
27
19
11
3
DS
26
18
10
2
AT91SAM9260
25
17
9
1
TCSR
LPCB
24
16
8
0
220

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