LPC2460FET208,551 NXP Semiconductors, LPC2460FET208,551 Datasheet - Page 6
LPC2460FET208,551
Manufacturer Part Number
LPC2460FET208,551
Description
IC ARM7 MCU ROMLESS 208TFBGA
Manufacturer
NXP Semiconductors
Series
LPC2400r
Specifications of LPC2460FET208,551
Program Memory Type
ROMless
Package / Case
208-TFBGA
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
160
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB2460, MCB2460U
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCB2400U - BOARD EVAL MCB2400 + ULINK2MCB2400 - BOARD EVAL FOR NXP LPC246X SER
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4260
935283232551
LPC2460FET208-S
935283232551
LPC2460FET208-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2460FET208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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NXP Semiconductors
4. Applications
5. Ordering options
Table 3.
Table 4.
Table 5.
UM10237_4
User manual
Type number
LPC2458FET180 TFBGA180 plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-2
Type number
LPC2458FET180
Type number
LPC2420FBD208 LQFP208
LPC2460FBD208 LQFP208
LPC2460FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 × 15 × 0.7 mm SOT950-1
LPC2458 ordering information
LPC2458 ordering options
LPC2420/60 ordering information
5.1 LPC2458 ordering options
5.2 LPC2460 ordering options
Package
Name
Package
Name
Flash
(kB)
512
•
•
•
•
•
•
Boundary scan for simplified board testing.
Versatile pin function selections allow more possibilities for using on-chip peripheral
functions.
Industrial control
Medical systems
Protocol converter
Communications
64 16 16 2
Description
Description
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
SRAM (kB)
98 16-bit
Rev. 04 — 26 August 2009
External
bus
Ethernet
MII/
RMII
Chapter 1: LPC24XX Introductory information
USB
OTG/
OHC/
DEV
+ 4 kB
FIFO
yes
2
SD/
MMC
yes
GP
DMA
yes
UM10237
© NXP B.V. 2009. All rights reserved.
8
1
Version
Version
SOT459-1
SOT459-1
Temp
range
−40 °C to
+85 °C
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