F272-BAG-T-TR STMicroelectronics, F272-BAG-T-TR Datasheet - Page 12

• Manufacturer Part Number: F272-BAG-T-TR
• Description: MCU 16BIT 256K FLASH 144-TQFP
• Manufacturer: STMicroelectronics
• Series: ST10r

Specifications of F272-BAG-T-TR

• Core Processor: ST10
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: ASC, CAN, EBI/EMI, I²C, SSC, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 111
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 20K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 144-TQFP, 144-VQFP
• Processor Series: ST10F27x
• Core: ST10
• Data Bus Width: 16 bit
• Data Ram Size: 12 KB
• Interface Type: ASC, CAN, I2C, SSC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 111
• Number Of Timers: 4
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 24 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

Introduction
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A second PWM mapped on the XBUS is added (PWM of ST10F269 becomes here PWM0,
while the new one is referred as XPWM or simply as PWM1). Note that some restrictions
and functional differences due to the XBUS peculiarities are present between the classic
PWM, and the new XPWM.
An I2C interface on the XBUS is added (see X-I2C or simply I2C interface).
CLKOUT function can output either the CPU clock (like in ST10F269) or a software
programmable prescaled value of the CPU clock.
On-chip RAM memory has been increased (Flash size remained the same).
PLL multiplication factors have been adapted to new frequency range.
A/D Converter is not fully compatible versus ST10F269 (timing and programming model).
Formula for the convertion time is still valid, while the sampling phase programming model is
different.
Besides, additional 8 channels are available on P1L pins as alternate function: the accuracy
reachable with these extra channels is reduced with respect to the standard Port5 channels.
External Memory bus is affected by limitations on maximum speed and maximum
capacitance load: ST10F272 is not able to address an external memory at 64MHz with 0
wait states.
XPERCON register bit mapping modified according to new peripherals implementation (not
fully compatible with ST10F269).
Bondout chip for emulation (ST10R201) cannot achieve more than 50MHz at room
temperature (so no real time emulation possible at maximum speed).
Input section characteristics are different. The threshold programmability is extended to all
port pins (additional XPICON register); it is possible to select standard TTL (with up to
400mV of hysteresis) and standard CMOS (with up to 750mV of hysteresis).
Output transition is not programmable.
CAN module is enhanced: ST10F272 implements two C-CAN modules, so the programming
model is slightly different. Besides, the possibility to map in parallel the two CAN modules is
added (on P4.5/P4.6).
On-chip main oscillator input frequency range has been reshaped, reducing it from 1-25MHz
down to 4-8MHz. This is a low power oscillator amplifier, that allows a power consumption
reduction when Real Time Clock is running in Power Down mode, using as reference the on-
chip main oscillator clock. When this on-chip amplifier is used as reference for Real Time
Clock module, the Power-down consumption is dominated by the consumption of the
oscillator amplifier itself.
A second on-chip oscillator amplifier circuit (32kHz) is implemented for low power modes: it
can be used to provide the reference to the Real Time Clock counter (either in Power Down
or Stand-by mode). Pin XTAL3 and XTAL4 replace a couple of VDD/VSS pins of ST10F269.
Possibility to re-program internal XBUS chip select window characteristics (XRAM2 window)
is added.
ST10F272B/ST10F272E