F272-BAG-T-TR STMicroelectronics, F272-BAG-T-TR Datasheet - Page 165

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F272-BAG-T-TR

Manufacturer Part Number
F272-BAG-T-TR
Description
MCU 16BIT 256K FLASH 144-TQFP
Manufacturer
STMicroelectronics
Series
ST10r
Datasheet

Specifications of F272-BAG-T-TR

Core Processor
ST10
Core Size
16-Bit
Speed
40MHz
Connectivity
ASC, CAN, EBI/EMI, I²C, SSC, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
111
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
144-TQFP, 144-VQFP
Processor Series
ST10F27x
Core
ST10
Data Bus Width
16 bit
Data Ram Size
12 KB
Interface Type
ASC, CAN, I2C, SSC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
111
Number Of Timers
4
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 24 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
F272-BAG-T-TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
F272-BAG-T-TR
Manufacturer:
ST
0
ST10F272B/ST10F272E
Table 78.
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
38
39
41
82
83
46
47
48
49
50
51
53
68
55
57
Symbol
CC
SR
CC
CC
CC
SR
SR
CC
CC
CC
SR
SR
SR
CC
CC
ALE falling edge to Latched
CS
Latched CS low to Valid Data
In
Latched CS hold after RD,
WR
Address setup to RdCS,
WrCS
(with RW-delay)
Address setup to RdCS,
WrCS
(no RW-delay)
RdCS to Valid Data In
(with RW-delay)
RdCS to Valid Data In
(no RW-delay)
RdCS, WrCS Low Time
(with RW-delay)
RdCS, WrCS Low Time
(no RW-delay)
Data valid to WrCS
Data hold after RdCS
Data float after RdCS
(with RW-delay)
Data float after RdCS
(no RW-delay)
Address hold after
RdCS, WrCS
Data hold after WrCS
Demultiplexed bus timings (continued)
1. RW-delay and t
2. Read data are latched with the same clock edge that triggers the address change and the rising RD edge.
3. Partially tested, guaranteed by design characterization.
Therefore address changes before the end of RD have no impact on read cycles.
Parameter
3
3
A
refer to the next following bus cycle.
– 8.5 + t
15.5 + t
14 + 2t
– 4 – t
2 + 2t
28 + t
10 + t
2 + t
2 + t
min.
F
0
TCL = 12.5 ns
CPU
F
F
A
C
C
A
A
C
F
= 40 MHz
+ t
16.5 + t
16.5 + t
16.5 +
4 + t
6 – t
4 + t
max.
C
+ 2t
A
C
F
C
F
A
2TCL – 11 + 2t
TCL –10.5 + 2t
2TCL – 9.5 + t
3TCL – 9.5 + t
TCL – 10.5 + t
TCL – 10.5 + t
2TCL – 15 + t
– 8.5 + t
– 4 – t
min.
1/2 TCL = 1 to 64MHz
Variable CPU Clock
0
A
F
Electrical characteristics
C
C
C
F
F
A
A
2TCL – 8.5 + t
2TCL – 21 + t
3TCL – 21 + t
TCL – 8.5 + t
3TCL – 21 +
+ t
6 – t
max.
C
+ 2t
A
A
F
C
C
F
165/182
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns

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