HD64F3672FPIV Renesas Electronics America, HD64F3672FPIV Datasheet - Page 290

MCU 3/5V 16K I-TEMP PB-FREE 64-L

HD64F3672FPIV

Manufacturer Part Number
HD64F3672FPIV
Description
MCU 3/5V 16K I-TEMP PB-FREE 64-L
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet

Specifications of HD64F3672FPIV

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
PWM, WDT
Number Of I /o
26
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
For Use With
R0K436079S000BE - KIT DEV FOR H8/36079 W/COMPILER
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Appendix
Table A.3
Note:
Rev.4.00 Nov. 02, 2005 Page 264 of 304
REJ09B0143-0400
Execution Status
(Instruction Cycle)
Instruction fetch
Branch address read
Stack operation
Byte data access
Word data access
Internal operation
*
Depends on which on-chip peripheral module is accessed. See section 16.1, Register
Addresses (Address Order).
Number of Cycles in Each Instruction
S
S
S
S
S
S
I
J
K
L
M
N
2
1
On-Chip Memory
Access Location
On-Chip Peripheral Module
2 or 3*

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