HD64F3337YCP16V Renesas Electronics America, HD64F3337YCP16V Datasheet - Page 402

• Manufacturer Part Number: HD64F3337YCP16V
• Description: MCU 3/5V 60K PB-FREE 84-PLCC
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300r

Specifications of HD64F3337YCP16V

• Core Size: 8-Bit
• Program Memory Size: 60KB (60K x 8)
• Oscillator Type: Internal
• Core Processor: H8/300
• Speed: 16MHz
• Connectivity: Host Interface, I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 74
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 84-PLCC
• No. Of I/o's: 74
• Ram Memory Size: 1KB
• Cpu Speed: 16MHz
• No. Of Timers: 6
• No. Of Pwm Channels: 2
• Digital Ic Case Style: PLCC
• Controller Family/series: H8/300
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

If a series of write errors occurs while the same PROM programmer is in use, stop programming
and check the PROM programmer and socket adapter for defects, using a microcontroller with on-
chip EPROM in a windowed package, for instance.
Please inform Hitachi of any abnormal conditions noted during programming or in screening of
program data after high-temperature baking.
18.3.4
Data is erased by exposing the transparent window in the package to ultraviolet light. The erase
conditions are shown in table 18.7.
Table 18.7 Erase Conditions
Item
Ultraviolet wavelength
Minimum irradiation
The erase conditions in table 18.7 can be met by exposure to a 12000 W/cm
positioned 2 to 3 cm directly above the chip for approximately 20 minutes.
372
Erasing Data
Figure 18.7 Recommended Screening Procedure
Value
253.7nm
15W • s/cm
Bake with power off
125 C to 150 C,
24 Hr to 48 Hr
Write and verify program
Read and check program
2
Install
2
ultraviolet lamp