HD64F2378RVFQ33 Renesas Electronics America, HD64F2378RVFQ33 Datasheet - Page 1128

• Manufacturer Part Number: HD64F2378RVFQ33
• Description: IC H8S MCU FLASH 512K 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of HD64F2378RVFQ33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 97
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 6x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 26 Electrical Characteristics
(4) DMAC and EXDMAC Timing
Table 26.35 DMAC and EXDMAC Timing
Conditions: V
Rev.7.00 Mar. 18, 2009 page 1060 of 1136
REJ09B0109-0700
Item
DREQ setup time
DREQ hold time
TEND delay time
DACK delay time 1
DACK delay time 2
EDREQ setup time
EDREQ hold time
ETEND delay time
EDACK delay time 1
EDACK delay time 2
EDRAK delay time
0 V, φ = 8 MHz to 34 MHz, T
T
a
CC
= −40°C to +85°C (wide-range specifications)
= 3.0 V to 3.6 V, AV
Symbol
t
t
t
t
t
t
t
t
t
t
t
DRQS
DRQH
TED
DACD1
DACD2
EDRQS
EDRQH
ETED
EDACD1
EDACD2
EDRKD
CC
= 3.0 V to 3.6 V, V
Min.
25
10
⎯
⎯
⎯
25
10
⎯
⎯
⎯
⎯
a
= −20°C to +75°C (regular specifications),
Max.
⎯
⎯
18
18
18
⎯
⎯
18
18
18
18
ref
= 3.0 V to AV
Unit
ns
ns
ns
ns
ns
Test Conditions
Figure 26.31
Figure 26.30
Figures 26.28 and 26.29
Figure 26.31
Figure 26.30
Figure 26.28 and 26.29
Figure 26.32
CC
, V
SS
= AV
SS
=