FMG2G200US60 Fairchild Semiconductor, FMG2G200US60 Datasheet - Page 3

• Manufacturer Part Number: FMG2G200US60
• Description: IGBT MOLDING 600V 200A 7PM-HA
• Manufacturer: Fairchild Semiconductor

Specifications of FMG2G200US60

• Configuration: Half Bridge
• Voltage - Collector Emitter Breakdown (max): 600V
• Vce(on) (max) @ Vge, Ic: 2.7V @ 15V, 200A
• Current - Collector (ic) (max): 200A
• Current - Collector Cutoff (max): 250µA
• Power - Max: 695W
• Input: Standard
• Ntc Thermistor: No
• Mounting Type: Chassis Mount
• Package / Case: 7PM-HA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Igbt Type: -
• Input Capacitance (cies) @ Vce: -

Company Information
Fairchild Semiconductor is the leading global supplier of high performance products that optimize power.
Our power semiconductor solutions address the world’s growing power requirements driven by an increased
demand for higher performance and more efficient electronics. We offer the broadest portfolio of products that
reduce power consumption while enabling longer battery life and reduced size and weight.
®
Fairchild is The Power Franchise
, supplying power semiconductors to the consumer, industrial, ultra-portable,
communications, and automotive market segments. Fairchild provides the Global Power Resource™—
a complete power design source that includes Power Systems Laboratories located worldwide, technical
expertise, and online resources that address designers’ specific application needs.
Analog & Mixed Signal products include Power Management, Analog Signal Processing and Data Conversion
ICs. Fairchild is driving continued innovation and portfolio expansion in product areas ranging from Off-Line
Switchers, DC/DC converters, PFC and PWM controllers, Battery Management, Data Converters (A/D and D/A)
and Video ICs to LDOs, System management & Supervision, LCD back light drive ICs, Electronic ballast ICs,
Motor ICs and Amplifiers. Fairchild also offers Microcontrollers and Application Specific Standard Products
(ASSP).
Fairchild’s Discrete Power portfolio is one of the industry’s broadest, and includes leading edge SuperFET™,
®
®
®
UltraFET
, PowerTrench
and QFET
MOSFETs, Bipolar Transistors, IGBTs, Schottky, Ultrafast, HyperFast
and Stealth™ Diode, and SPM™ (Smart Power Module). Fairchild’s extensive discrete packaging includes
advanced small package solutions with the advantages of superior size, low package height, and excellent
thermal and electrical performance.
Interface & Logic products include LVDS, GTLP, Universal Serial Bus, DIMM and 1284 standard products.
®
Interface & Logic is also comprised of logic level translator products, TinyLogic
products, low voltage products,
analog switches, bus switches and standard logic products. Fairchild’s packaging solutions range from space
saving MicroPak™ and DQFN packaging, to high pin count QVSOP and BGA packaging.
Optoelectronic products include optocouplers, Solid State Relays, LED lamps and displays, and infrared
components. Fairchild’s portfolio of industry standard and application specific devices features a variety of
advanced solutions including a full-color spectrum of low power and high brightness SMD LEDs, infrared
variable sensing, mini-flat packages, surface-mount LEDs and infrared, Solid State Relays and isolated error
amplifiers. A complete set of safety approval certifications are available for optocoupler products.
RF products provides RF power amplifier solutions for wireless communication systems like Wi-Fi™, CDMA
and WCDMA cellular handsets. RF packaging solutions include advanced small package options with a small
footprint, low package profile and superior thermal and electrical performance.
Fairchild employs 9,000 people worldwide and is headquartered in South Portland, Maine. Additional U.S.
design and manufacturing facilities are located in California, Pennsylvania, Colorado and Utah with
manufacturing, assembly and test sites in Malaysia, Singapore, the Philippines, China and South Korea.
www.fairchildsemi.com
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