FDFME2P823ZT Fairchild Semiconductor, FDFME2P823ZT Datasheet

Various MOSFETs -20V Integrated P-Ch PwrTrnch w/Sch Diode

FDFME2P823ZT

Manufacturer Part Number
FDFME2P823ZT
Description
Various MOSFETs -20V Integrated P-Ch PwrTrnch w/Sch Diode
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of FDFME2P823ZT

Forward Transconductance Gfs (max / Min)
7 S
Gate Charge Qg
5.5 nC
Minimum Operating Temperature
- 55 C
Mounting Style
SMD/SMT
Configuration
Single
Transistor Polarity
P-Channel
Package / Case
MicroFET 1.6 x 1.6 Thin
Resistance Drain-source Rds (on)
95 mOhms
Drain-source Breakdown Voltage
- 20 V
Continuous Drain Current
- 2.3 A
Power Dissipation
1.3 W
Maximum Operating Temperature
+ 150 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
©2010 Fairchild Semiconductor Corporation
FDFME2P823ZT Rev.C1
FDFME2P823ZT
Integrated P-Channel PowerTrench
-20 V, -2.6 A, 142 mΩ
Features
MOSFET Maximum Ratings
Thermal Characteristics
Package Marking and Ordering Information
V
V
I
P
V
I
T
R
R
R
R
D
O
Pin 1
DS
GS
D
RRM
J
θJA
θJA
θJA
θJA
Max r
Max r
Max r
Max r
Low profile:
MicroFET 1.6x1.6 Thin
Schottky: V
Free from halogenated compounds and antimony oxides
HBM ESD protection level > 1600 V (Note 3)
RoHS Compliant
, T
Symbol
Device Marking
STG
DS(on)
DS(on)
DS(on)
DS(on)
3T
A
= 142 mΩ at V
= 213 mΩ at V
= 331 mΩ at V
= 530 mΩ at V
F
NC
< 0.57 V @ 1A
Drain to Source Voltage
Gate to Source Voltage
Drain Current -Continuous
Power Dissipation for Single Operation
Power Dissipation for Single Operation
Schottky Repetitive Peak Reverse Voltage
Schottky Average Forward Current
Operating and Storage Junction Temperature Range
Thermal Resistance, Junction to Ambient (Single Operation)
Thermal Resistance, Junction to Ambient (Single Operation)
Thermal Resistance, Junction to Ambient (Single Operation)
Thermal Resistance, Junction to Ambient (Single Operation)
0.55 mm maximum in the new package
D
BOTTOM
K
FDFME2P823ZT
GS
GS
GS
GS
D
= -4.5 V, I
= -2.5 V, I
= -1.8 V, I
= -1.5 V, I
Device
-Pulsed
K
MicroFET 1.6x1.6 Thin
G
D
D
D
D
= -2.3 A
= -1.8 A
= -1.5 A
= -1.2 A
S
T
A
= 25 °C unless otherwise noted
MicroFET 1.6x1.6 Thin
Parameter
Package
®
1
MOSFET and Schottky Diode
T
T
T
A
A
A
= 25 °C
= 25 °C
= 25 °C
General Description
This device is designed specifically as a single package solution
for the battery charge switch in cellular handset and other
ultra-portable appliacrions. It features as MOSFET with low
on-state resistance and an independently connected low forward
voltage schottky diode for minimum condution losses.
The MicroFET 1.6x1.6 Thin package offers exceptional thermal
performance for it's physical size and is well suited to switching
and linear mode applications.
Applications
TOP
Battery Charging
DC-DC Conversion
Reel Size
7 ’’
(Note 1a)
(Note 1a)
(Note 1b)
(Note 1a)
(Note 1b)
(Note 1c)
(Note 1d)
(Note 4)
NC
D
A
1
2
3
Tape Width
8 mm
-55 to +150
Ratings
-2.6
195
234
110
-20
1.4
0.6
±8
28
90
-6
1
www.fairchildsemi.com
5000 units
Quantity
July 2010
6
5
4
Units
°C/W
S
K
G
°C
W
V
A
V
V
A

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FDFME2P823ZT Summary of contents

Page 1

... Thermal Resistance, Junction to Ambient (Single Operation) θJA Package Marking and Ordering Information Device Marking Device 3T FDFME2P823ZT ©2010 Fairchild Semiconductor Corporation FDFME2P823ZT Rev.C1 ® MOSFET and Schottky Diode General Description This device is designed specifically as a single package solution = -2 for the battery charge switch in cellular handset and other = -1 ...

Page 2

... Source to Drain Diode Forward Voltage SD t Reverse Recovery Time rr Q Reverse Recovery Charge rr Schottky Diode Characteristics I Reverse Leakage R V Forward Voltage F V Forward Voltage F ©2010 Fairchild Semiconductor Corporation FDFME2P823ZT Rev. °C unless otherwise noted J Test Conditions = -250 μ -250 μA, referenced to 25 ° - ± ...

Page 3

... Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%. 3. The diode connected between the gate and source serves only as protection ESD. No gate overvoltage rating is implied. 4. Rating is applicable to MOSFET only. ©2010 Fairchild Semiconductor Corporation FDFME2P823ZT Rev.C1 2 oz. copper pad on a 1.5 x 1.5 in. board of FR-4 material pad copper, 1.5 " ...

Page 4

... PULSE DURATION = 80 s DUTY CYCLE = 0.5% MAX 150 0.0 0.5 1 GATE TO SOURCE VOLTAGE (V) GS Figure 5. Transfer Characteristics ©2010 Fairchild Semiconductor Corporation FDFME2P823ZT Rev. 25°C unless otherwise noted J μ s 1.5 2.0 500 400 300 200 100 50 75 100 125 150 0 0. -55 ...

Page 5

... 0.01 0 DRAIN to SOURCE VOLTAGE (V) DS Figure 9. Forward Bias Safe Operating Area - 125 100 REVERSE VOLTAGE (V) R Figure 11. Schottky Diode Reverse Current ©2010 Fairchild Semiconductor Corporation FDFME2P823ZT Rev. 25°C unless otherwise noted J 1000 100 100 100 0. 0.001 Figure 12. Schottky Diode Forward Voltage ...

Page 6

... Figure 13. Single Pulse Maximum Power Dissipation 2 DUTY CYCLE-DESCENDING ORDER 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 SINGLE PULSE R 0.001 - Figure 14. Junction-to-Ambient Transient Thermal Response Curve ©2010 Fairchild Semiconductor Corporation FDFME2P823ZT Rev. 25°C unless otherwise noted PULSE WIDTH ( 195 C/W θ RECTANGULAR PULSE DURATION (s) 6 ...

Page 7

... Dimensional Outline and Pad Layout ©2010 Fairchild Semiconductor Corporation FDFME2P823ZT Rev.C1 7 www.fairchildsemi.com ...

Page 8

... Product Status Advance Information Formative / In Design Preliminary First Production No Identification Needed Full Production Obsolete Not In Production ©2010 Fairchild Semiconductor Corporation FDFME2P823ZT Rev.C1 F-PFS™ Power-SPM™ ® FRFET PowerTrench SM Global Power Resource PowerXS™ Green FPS™ Programmable Active Droop™ ...

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