1ED020I12-F Infineon Technologies, 1ED020I12-F Datasheet - Page 20
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1ED020I12-F
Manufacturer Part Number
1ED020I12-F
Description
MOSFET & Power Driver ICs SNGL IGBT Driver IC IGBT Driver IC
Manufacturer
Infineon Technologies
Datasheet
1.1ED020I12-F.pdf
(22 pages)
Specifications of 1ED020I12-F
Product
Driver ICs - Various
Rise Time
400 ns
Fall Time
600 ns
Supply Voltage (max)
5.5 V, 20 V, 0 V
Supply Voltage (min)
4.5 V, 13 V, - 12 V
Maximum Power Dissipation
700 mW
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Number Of Drivers
1
Number Of Outputs
1
Package / Case
PG-DSO-16-15
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
1ED020I12-F
Manufacturer:
VISHAY
Quantity:
400 000
Part Number:
1ED020I12-F
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Company:
Part Number:
1ED020I12-F2
Manufacturer:
INFINEON
Quantity:
2 190
Part Number:
1ED020I12-F2
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Part Number:
1ED020I12-FA
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Part Number:
1ED020I12-FT
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
8
8.1
The PCB layout shown in figure 12 represents the reference layout used for the thermal characterisation. Pins 9 and 16
(GND1) and pins 1 and 8 (VEE2) require ground plane connections for achiving maximum power dissipation. The
1ED020I12-F is conceived to dissipate most of the heat generated through this pins.
8.2
Following factors should be taken into account for an optimum PCB layout.
- Sufficient spacing should be kept between high voltage isolated side and low voltage side circuits.
- The same minimum distance between two adjacent high-side isolated parts of the PCB should be maintained to increase the
effective isolation and reduce parasitic coupling.
- In order to ensure low supply ripple and clean switching signals, bypass capacitor trace lengths should be kept as short as
possible.
Datasheet
Total Area = 374.4 mm
Output Side
Application Notes
Reference Layout for Thermal Data
Printed Circuit Board Guidelines
Figure 10: Reference layout for thermal data (Copper thickness 105 m)
2
20
PCB + Bottom-Layer
Input Side
PCB + Top-Layer
Version 2.2, 2009-12-03
EICEDRIVER
Application Notes
1ED020I12-F
TM