A2F200M3F-1FGG256 Actel, A2F200M3F-1FGG256 Datasheet - Page 119
A2F200M3F-1FGG256
Manufacturer Part Number
A2F200M3F-1FGG256
Description
FPGA - Field Programmable Gate Array 200K System Gates SmartFusion
Manufacturer
Actel
Datasheet
1.A2F500M3G-FGG256.pdf
(192 pages)
Specifications of A2F200M3F-1FGG256
Processor Series
A2F200
Core
ARM Cortex M3
Number Of Logic Blocks
8
Maximum Operating Frequency
120 MHz
Number Of Programmable I/os
117
Data Ram Size
4608 bit
Delay Time
200 ns
Supply Voltage (max)
3.6 V
Supply Current
3 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
0 C
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
A2F-Eval-Kit, A2F-Dev-Kit, FlashPro 3, FlashPro Lite, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
Mounting Style
SMD/SMT
Supply Voltage (min)
1.425 V
Number Of Gates
200000
Package / Case
FPBGA-256
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
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Part Number:
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Part Number:
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Manufacturer:
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Part Number:
A2F200M3F-1FGG256I
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Microsemi SoC
Quantity:
10 000
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Table 5-1 • Recommended Tie-Off Values for the TCK and TRST Pins
V
V
V
V
V
Notes:
1. The TCK pin can be pulled up/down.
2. The TRST pin can only be pulled down.
1. Equivalent parallel resistance if more than one device is on JTAG chain.
JTAG
JTAG
JTAG
JTAG
JTAG
at 3.3 V
at 2.5 V
at 1.8 V
at 1.5 V
R e v i s i o n 6
SmartFusion Intelligent Mixed Signal FPGAs
Tie-Off Resistance
200 Ω to 1 kΩ
200 Ω to 1 kΩ
500 Ω to 1 kΩ
500 Ω to 1 kΩ
1, 2
5 -9
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