A2F200M3F-1FGG256 Actel, A2F200M3F-1FGG256 Datasheet - Page 48
A2F200M3F-1FGG256
Manufacturer Part Number
A2F200M3F-1FGG256
Description
FPGA - Field Programmable Gate Array 200K System Gates SmartFusion
Manufacturer
Actel
Datasheet
1.A2F500M3G-FGG256.pdf
(192 pages)
Specifications of A2F200M3F-1FGG256
Processor Series
A2F200
Core
ARM Cortex M3
Number Of Logic Blocks
8
Maximum Operating Frequency
120 MHz
Number Of Programmable I/os
117
Data Ram Size
4608 bit
Delay Time
200 ns
Supply Voltage (max)
3.6 V
Supply Current
3 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
0 C
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
A2F-Eval-Kit, A2F-Dev-Kit, FlashPro 3, FlashPro Lite, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
Mounting Style
SMD/SMT
Supply Voltage (min)
1.425 V
Number Of Gates
200000
Package / Case
FPBGA-256
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
A2F200M3F-1FGG256
Manufacturer:
ACT
Quantity:
36
Company:
Part Number:
A2F200M3F-1FGG256
Manufacturer:
Microsemi SoC
Quantity:
10 000
Company:
Part Number:
A2F200M3F-1FGG256I
Manufacturer:
Microsemi SoC
Quantity:
10 000
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SmartFusion DC and Switching Characteristics
Table 2-51 • 1.8 V LVCMOS High Slew
2- 36
Drive
Strength
4 mA
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to
Worst Commercial-Case Conditions: T
Worst-Case VCCxxxxIOBx = 1.7 V
Applicable to MSS I/O Banks
Speed
Grade
Std.
–1
t
DOUT
0.22
0.18
2.77
2.31
t
DP
0.09
0.07
t
DIN
J
1.09 1.64
0.91 1.37
t
= 85°C, Worst-Case VCC = 1.425 V,
PY
R e visio n 6
t
PYS
t
Table 2-7 on page 2-9
0.22
0.18
EOUT
2.82
2.35
t
ZL
2.72
2.27
t
ZH
for derating values.
2.21
1.84
t
LZ
2.25
1.87
t
HZ
Units
ns
ns
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