A2F200M3F-1FGG256 Actel, A2F200M3F-1FGG256 Datasheet - Page 26
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A2F200M3F-1FGG256
Manufacturer Part Number
A2F200M3F-1FGG256
Description
FPGA - Field Programmable Gate Array 200K System Gates SmartFusion
Manufacturer
Actel
Datasheet
1.A2F500M3G-FGG256.pdf
(192 pages)
Specifications of A2F200M3F-1FGG256
Processor Series
A2F200
Core
ARM Cortex M3
Number Of Logic Blocks
8
Maximum Operating Frequency
120 MHz
Number Of Programmable I/os
117
Data Ram Size
4608 bit
Delay Time
200 ns
Supply Voltage (max)
3.6 V
Supply Current
3 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
0 C
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
A2F-Eval-Kit, A2F-Dev-Kit, FlashPro 3, FlashPro Lite, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
Mounting Style
SMD/SMT
Supply Voltage (min)
1.425 V
Number Of Gates
200000
Package / Case
FPBGA-256
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
A2F200M3F-1FGG256
Manufacturer:
ACT
Quantity:
36
Company:
Part Number:
A2F200M3F-1FGG256
Manufacturer:
Microsemi SoC
Quantity:
10 000
Company:
Part Number:
A2F200M3F-1FGG256I
Manufacturer:
Microsemi SoC
Quantity:
10 000
SmartFusion DC and Switching Characteristics
2- 14
Power Calculation Methodology
This section describes a simplified method to estimate power consumption of an application. For more
accurate and detailed power estimations, use the SmartPower tool in the Libero IDE software.
The power calculation methodology described below uses the following variables:
The calculation should be repeated for each clock domain defined in the design.
Methodology
Total Power Consumption—P
Total Static Power Consumption—P
Total Dynamic Power Consumption—P
•
•
•
•
•
•
•
•
•
•
•
SoC Mode, Standby Mode, and Time Keeping Mode.
P
SoC Mode
P
Standby Mode
P
Time Keeping Mode
P
SoC Mode
P
P
TOTAL
STAT
STAT
STAT
DYN
XTL-OSC
The number of PLLs/CCCs as well as the number and the frequency of each output clock
generated
The number of combinatorial and sequential cells used in the design
The internal clock frequencies
The number and the standard of I/O pins used in the design
The number of RAM blocks used in the design
The number of eNVM blocks used in the design
The analog block used in the design, including the temperature monitor, current monitor, ABPS,
sigma-delta DAC, comparator, low power crystal oscillator, RC oscillator and the main crystal
oscillator
Toggle rates of I/O pins as well as VersaTiles—guidelines are provided in
page
Enable rates of output buffers—guidelines are provided for typical applications in
page
Read rate and write rate to the memory—guidelines are provided for typical applications in
Table 2-17 on page
Read rate to the eNVM blocks
P
P
N
N
N
N
STAT
DYN
eNVM-BLOCKS
INPUTS
OUTPUTS
PLLS
= P
= P
= P
= P
= P
2-18.
2-18.
CLOCK
is the total dynamic power consumption.
DC1
DC2
DC3
+ P
is the total static power consumption.
is the number of PLLs available in the device.
STAT
is the number of I/O input buffers used in the design.
RC-OSC
+ (N
is the number of I/O output buffers used in the design.
+ P
+ P
eNVM-BLOCKS
is the number of eNVM blocks available in the device.
S-CELL
DYN
+ P
2-18.
AB
+ P
+ P
C-CELL
LPXTAL-OSC
TOTAL
* P
DC4
+ P
) + (N
STAT
NET
R e visio n 6
+ P
DYN
INPUTS
+ P
MSS
INPUTS
* P
DC7
+ P
) + (N
OUTPUTS
OUTPUTS
+ P
MEMORY
* P
DC8
) + (N
+ P
PLL
PLLS
Table 2-16 on
Table 2-17 on
+ P
* P
eNVM
DC9
+
)