NTHS0603N10N1502JE Vishay, NTHS0603N10N1502JE Datasheet - Page 15

• Manufacturer Part Number: NTHS0603N10N1502JE
• Description: THERMISTOR NTC 15K OHM 5% 0603
• Manufacturer: Vishay
• Series: NTHSr

Specifications of NTHS0603N10N1502JE

• Resistance In Ohms @ 25°c: 15K
• Resistance Tolerance: ±5%
• B Value Tolerance: ±3%
• B25/75: 3500K
• Mounting Type: Surface Mount
• Package / Case: 0603 (1608 Metric)
• Lead Free Status / RoHS Status: Lead free by exemption / RoHS Compliant
• B0/50: -
• B25/50: -
• B25/85: -
• B25/100: -
• Operating Temperature: -
• Power - Max: -
• Lead Length: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 541-1114-2

6.
October 29, 2008 S29GL-N_01_12
S29GL032N
Notes
1. Type 0 is standard. Specify others as required: TSOPs can be packed in
2. TSOP package marking omits packing type designator from ordering
3. BGA package marking omits leading S29 and packing type designator
4. Contact local sales for availability for Leaded lead-frame parts.
S29GL032N
Number
Device
Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
part number.
from ordering part number.
Ordering Information–S29GL032N
DEVICE NUMBER/DESCRIPTION
S29GL032N
32 Megabit Page-Mode Flash Memory
Manufactured using 110 nm MirrorBit
90
Option
Speed
90
90
11
90
90
11
90
11
T
S29GL032N Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid
Combination) is formed by a combination of the following:
F
S29GL032N Valid Combinations
I
& Temperature Range
Package, Material,
01
0
BFI
DFI
TFI
FFI
PACKING TYPE
0
2
3
MODEL NUMBER
01 = x8/x16, V
02 = x8/x16, V
03 = x8/x16, V
04 = x8/x16, V
V1 = x8/x16, V
V2 = x8/x16, V
TEMPERATURE RANGE
I
PACKAGE MATERIAL SET
A
F
PACKAGE TYPE
B
D = Fortified Ball-Grid Array Package(LAE064), 9 mm x 9 mm
F
T
SPEED OPTION
See Product Selector Guide and Valid Combinations (90 = 90 ns, 11 = 110 ns)
Table 6.1 S29GL032N Ordering Options
= Tray
= 7-inch Tape and Reel
= 13-inch Tape and Reel
= Industrial (–40°C to +85°C)
= Standard
= Pb-Free
= Fine-pitch Ball-Grid Array Package
= Fortified Ball-Grid Array Package (LAA064), 13 mm x 11 mm
= Thin Small Outline Package (TSOP) Standard Pinout
®
sector
Process Technology, 3.0 Volt-only Read, Program, and Erase
D a t a
01, 02, 03, 04
01, 02, 03, 04
S29GL-N MirrorBit
CC
CC
CC
CC
CC
CC
Number
(Note 4)
V1, V2
V1, V2
V1, V2
Model
01, 02
03, 04
03, 04
= V
= V
= 2.7 – 3.6 V, Top boot sector, WP#/ACC = V
= 2.7 – 3.6 V, Bottom boot sector, WP#/ACC = V
= 2.7 – 3.6 V, V
= 2.7 – 3.6 V, V
S h e e t
IO
IO
= 2.7 – 3.6 V, Uniform sector, WP#/ACC = V
= 2.7 – 3.6 V, Uniform sector, WP#/ACC = V
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this
device. Consult your local sales office to confirm availability of specific valid
combinations and to check on newly released combinations.
Packing
(Note 1)
Type
0,2,3
IO
IO
®
= 1.65 - 3.6 V, Uniform sector, WP#/ACC = V
= 1.65 - 3.6 V, Uniform sector, WP#/ACC = V
Flash Family
TS048
TS056
VBK048
LAA064
LAE064
(Note 2)
(Note 2)
(Note 3)
(Note 3)
(Note 3)
(Note 4)
IL
TSOP
Fine-Pitch BGA
Fortified BGA
protects top two addressed sectors
IL
Package Description
IL
IL
protects bottom two addressed sectors
protects highest addressed sector
protects lowest addressed sector
IL
IL
protects lowest addressed sector
protects highest addressed
15