CV500-ZS3AT1-EV2 Omron, CV500-ZS3AT1-EV2 Datasheet - Page 58

• Manufacturer Part Number: CV500-ZS3AT1-EV2
• Description: C.V SOFTWARE 3.5in DISK
• Manufacturer: Omron

Specifications of CV500-ZS3AT1-EV2

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Installation Environment
3-2
Ambient Conditions
Cooling
Installation Environment
!
Caution
When the Expansion Data Memory Unit is mounted to the CPU, the Expansion
Data Memory Unit is backed up by the battery in the CPU.
When the Unit has been removed from the CPU, the memory contents will be
retained for about 10 minutes by a backup capacitor built-in to the Unit, provided
that CPU power was ON and that the Unit was mounted in the CPU for at least 1
minute.
When removing the Expansion Data Memory Unit, be sure to turn ON the power
to the PC for more than 1 minute and then turn it OFF. At that time the capacitor
will be fully charged allowing it to be backed up for 10 minutes. The retention
period will be shorter if Memory Unit has been mounted (to the CPU) for less
than 1 minute.
This section details the necessary environmental conditions for installing the
PC.
Static electricity can damage PC components. Your body can carry an electro-
static charge, especially when the humidity is low. Before touching the PC, be
sure to first touch a grounded metallic object, such as a metal water pipe, in order
to discharge any static build-up.
Do not install the PC in any of the following locations. Doing so will affect PC life
and may affect operating performance.
There are two points to consider in order to ensure that the PC does not over-
heat. The first is the clearance between the Racks, and the second is installation
of a cooling fan.
Insert the bottom part of the
bracket into the groove of the
case and then press the
bracket into place and tighten
the bracket screw.
5. Re-attach the bracket
6. Attach the cover to the compartment.
Locations subject to ambient temperatures lower than 0 C or higher than
55 C.
Locations subject to drastic temperature changes or condensation.
Locations subject to ambient humidity lower than 10% or higher than 90%.
Locations subject to corrosive or flammable gases.
Locations subject to excessive dust (especially iron dust) or chloride.
Locations that would subject the CPU to direct shock or vibration.
Locations that would subject the PC to water, oil, or chemical reagents.
Locations exposed to direct sunlight.
Bracket
Section 3-2
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