LPC2364HBD100 NXP Semiconductors, LPC2364HBD100 Datasheet - Page 41

• Manufacturer Part Number: LPC2364HBD100
• Description: LPC2364HBD100/LQFP100/TRAYBDP/
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2364HBD100

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 34K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-LQFP
• Processor Series: LPC23
• Core: ARM7TDMI-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

NXP Semiconductors
LPC2364_65_66_67_68_6
Product data sheet
9.1 Power-down mode
Fig 5.
Fig 6.
I
DD(IO)
(μA)
(μA)
I
BAT
−2
−4
40
30
20
10
V
I/O maximum supply current I
RTC battery maximum supply current I
mode
V
4
2
0
0
−40
i(VBAT)
−40
DD(3V3)
= V
= V
DD(DCDC)(3V3)
DD(DCDC)(3V3)
Rev. 06 — 1 February 2010
−15
−15
V
V
i(VBAT)
i(VBAT)
= 3.3 V; T
= 3.3 V; T
= 3.3 V
= 3.0 V
amb
10
10
DD(IO)
amb
= 25 °C.
= 25 °C.
versus temperature in Power-down mode
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
BAT
V
V
versus temperature in Power-down
DD(3V3)
DD(3V3)
35
35
= 3.3 V
= 3.0 V
60
60
temperature (°C)
temperature (°C)
002aae049
002aae050
© NXP B.V. 2010. All rights reserved.
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