LPC2364HBD100 NXP Semiconductors, LPC2364HBD100 Datasheet - Page 49

• Manufacturer Part Number: LPC2364HBD100
• Description: LPC2364HBD100/LQFP100/TRAYBDP/
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2364HBD100

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 34K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-LQFP
• Processor Series: LPC23
• Core: ARM7TDMI-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
LPC23XX
R vsi
20 kΩ
AD0[y]
AD0[y]
SAMPLE
3 pF
5 pF
V EXT
V
SS
002aac610
Fig 15. Suggested ADC interface - LPC2364/65/66/67/68 AD0[y] pin
LPC2364_65_66_67_68_6
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 06 — 1 February 2010
49 of 59