LPC2364HBD100 NXP Semiconductors, LPC2364HBD100 Datasheet - Page 50

LPC2364HBD100/LQFP100/TRAYBDP/

LPC2364HBD100

Manufacturer Part Number
LPC2364HBD100
Description
LPC2364HBD100/LQFP100/TRAYBDP/
Manufacturer
NXP Semiconductors
Series
LPC2300r
Datasheet

Specifications of LPC2364HBD100

Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
34K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
100-LQFP
Processor Series
LPC23
Core
ARM7TDMI-S
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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NXP Semiconductors
12. DAC electrical characteristics
Table 11.
V
13. Application information
LPC2364_65_66_67_68_6
Product data sheet
Symbol
E
E
E
E
C
R
DDA
Fig 16. LPC2364/66/68 USB interface on a self-powered device
D
L(adj)
O
G
L
L
= 2.7 V to 3.6 V; T
DAC electrical characteristics
Parameter
differential linearity error
integral non-linearity
offset error
gain error
load capacitance
load resistance
13.1 Suggested USB interface solutions (LPC2364/66/68 only)
amb
=
40
LPC23XX
°
C to +85
Conditions
°
C unless otherwise specified
V
USB_UP_LED
USB_CONNECT
V
USB_D+
USB_D−
V
Rev. 06 — 1 February 2010
DD(3V3)
BUS
SS
R S = 33 Ω
R S = 33 Ω
R1
1.5 kΩ
SoftConnect switch
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
Min
-
-
-
-
-
1
002aac578
Typ
±1
±1.5
0.6
0.6
200
-
USB-B
connector
Max
-
-
-
-
-
-
© NXP B.V. 2010. All rights reserved.
Unit
LSB
LSB
%
%
pF
50 of 59

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