LPC2364HBD100 NXP Semiconductors, LPC2364HBD100 Datasheet - Page 43

LPC2364HBD100/LQFP100/TRAYBDP/

LPC2364HBD100

Manufacturer Part Number
LPC2364HBD100
Description
LPC2364HBD100/LQFP100/TRAYBDP/
Manufacturer
NXP Semiconductors
Series
LPC2300r
Datasheet

Specifications of LPC2364HBD100

Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
34K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
100-LQFP
Processor Series
LPC23
Core
ARM7TDMI-S
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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NXP Semiconductors
LPC2364_65_66_67_68_6
Product data sheet
Fig 9.
Fig 10. Total DC-to-DC converter maximum supply current I
I
DD(DCDC)dpd(3v3)
(μA)
I
BAT
40
30
20
10
100
RTC battery maximum supply current I
power-down mode
V
temperature in Deep power-down mode
V
(μA)
0
80
60
40
20
−40
DD(3V3)
DD(3V3)
0
−40
V
V
DD(DCDC)(3V3)
DD(DCDC)(3V3)
= V
= V
i(VBAT)
DD(DCDC)(3V3)
Rev. 06 — 1 February 2010
−15
= 3.3 V; T
−15
V
V
i(VBAT)
i(VBAT)
= 3.0 V
= 3.3 V
= 3.3 V; T
= 3.3 V
= 3.0 V
amb
= 25 °C.
10
amb
10
= 25 °C
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
BAT
35
versus temperature in Deep
35
DD(DCDC)dpd(3V3)
60
60
temperature (°C)
temperature (°C)
002aae047
© NXP B.V. 2010. All rights reserved.
002aae048
versus
85
85
43 of 59

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