FDG6320C Fairchild Semiconductor, FDG6320C Datasheet

FDG6320C

Manufacturer Part Number

FDG6320C

Description

MOSFET N/P-CH DUAL 25V SC70-6

Manufacturer

Fairchild Semiconductor

Datasheet

1.FDG6320C.pdf (9 pages)

Specifications of FDG6320C

Fet Type

N and P-Channel

Fet Feature

Logic Level Gate

Rds On (max) @ Id, Vgs

4 Ohm @ 220mA, 4.5V

Drain To Source Voltage (vdss)

25V

Current - Continuous Drain (id) @ 25° C

220mA, 140mA

Vgs(th) (max) @ Id

1.5V @ 250µA

Gate Charge (qg) @ Vgs

0.4nC @ 4.5V

Input Capacitance (ciss) @ Vds

9.5pF @ 10V

Power - Max

300mW

Mounting Type

Surface Mount

Package / Case

SC-70-6, SC-88, SOT-363

Configuration

Dual

Transistor Polarity

N and P-Channel

Resistance Drain-source Rds (on)

4 Ohm @ 4.5 V @ N Channel

Forward Transconductance Gfs (max / Min)

0.2 S, 0.12 S

Drain-source Breakdown Voltage

25 V

Gate-source Breakdown Voltage

8 V

Continuous Drain Current

0.22 A @ N Channel or 0.14 A @ P Channel

Power Dissipation

300 mW

Maximum Operating Temperature

+ 150 C

Mounting Style

SMD/SMT

Minimum Operating Temperature

- 55 C

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Meier Automation Equipment Co., Limited

Part Number:

FDG6320C

Manufacturer:

FAIRCHILD/仙童

Quantity:

20 000

Company:

H&T Electronics

Part Number:

FDG6320C

Quantity:

4 500

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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

Updated process quality documentation, such as FMEAs and Control Plans, are available for

viewing upon request.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Ursal, Randy

E-mail: Randy.Ursal@notes.fairchildsemi.com

Phone:

Implementation of change:

Expected 1st Device Shipment Date: 2008/05/29

Earliest Year/Work Week of Changed Product: 0822

Change Type Description: Mold Compound

Description of Change (From): SC70 package assembly in FSC approved manufacturing

location (FSCP) using non Green mold compound as shown in table 1:

Description of Change (To): SC70 package assembly in FSC approved manufacturing location

(FSCP) using Green mold compound as shown in table 2:

Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is

dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level

interconnect lead-free and RoHS compliance. The referenced material changes have been made

to provide a 'Full Green' (Halogen Free Flame Retardant) package. For additional details on the

corporate wide green initiative please visit our Web site at:

http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same

assembly facilities producing the current non-green products. Package outline drawings of the

affected products remain un-changed. Green products will be fully compliant to all published

data sheet specifications and will be interchangeable with current non-green product. Quality

and reliability will remain at the highest standards already demonstrated with Fairchild's

existing products.

Qual/REL Plan Numbers : Q20070416

Qualification :

The Reliability Test requirements as defined in iRel QP Q20070416 for SC70-6L in

Green EMC passed the Reliability Requirements using Green EMC GR828HS.

DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL

Technical Contact:

Name: Ursal, Randy

E-mail: Randy.Ursal@notes.fairchildsemi.com

Phone:

Date Issued On : 2008/05/07

Date Created : 2008/04/17

PCN# : Q4074815-A

Pg. 1

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FDG6320C Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

Change From Change To Pg. 2 ...

Page 3

Results/Discussion Test: (Autoclave) Lot Device Q20070416AAACLV FDG313N Q20070416ABACLV FDG313N Q20070416ACACLV FDG313N Q20070416BAACLV FDG6323L Q20070416BBACLV FDG6323L Q20070416BCACLV FDG6323L Q20070416CAACLV FDG361N Q20070416DAACLV NC7WZ17P6X Test: (High Humidity, High Temp, Rev. Bias) Lot Device Q20070416AAH3TRB FDG313N Q20070416ABH3TRB FDG313N Q20070416ACH3TRB FDG313N Test: (High Temperature Gate ...

Page 4

Q20070416CAHTGB FDG361N Q20070416CAHTGB FDG361N Test: (High Temperature Reverse Bias) Lot Device Q20070416AAHTRB FDG313N Q20070416AAHTRB FDG313N Q20070416ABHTRB FDG313N Q20070416ABHTRB FDG313N Q20070416ACHTRB FDG313N Q20070416ACHTRB FDG313N Q20070416CAHTRB FDG361N Q20070416CAHTRB FDG361N Test: (Power Cycle) Lot Device Q20070416AAPRCL FDG313N Q20070416AAPRCL FDG313N Q20070416ABPRCL FDG313N Q20070416ABPRCL FDG313N ...

Page 5

... FDG315N FDG326P FDG327NZ FDG328P_NL FDG332PZ FDG6301N_NL FDG6303N_NL FDG6304P_NL FDG6306P_SBGX002 FDG6316P FDG6318P FDG6320C FDG6321C_NL FDG6323L FDG6331L FDG6332C_NL FDG6335N_NL FDG8850NZ Failure Code Failure Code FDG312P FDG313N_NL FDG316P FDG326P_NL FDG327N_NL FDG329N FDG361N FDG6302P FDG6304P FDG6306P FDG6308P FDG6316P_NL FDG6318PZ FDG6320C_NL FDG6322C FDG6323L_NL FDG6331L_NL FDG6335N FDG6342L Pg. 5 ...

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