SPD50P03L G Infineon Technologies, SPD50P03L G Datasheet
SPD50P03L G
Specifications of SPD50P03L G
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SPD50P03L G Summary of contents
Page 1
... =25 °C D,pulse =- =- /dt di /dt =-200 A/µs, T =175 °C j,max =25 °C tot stg page 1 SPD50P03L G Product Summary V - DS(on),max I -50 D PG-TO252-5 Lead Free Yes Value -50 -50 -200 =25 Ω 256 = ±20 150 -55…+175 1C 260 55/175/56 2008-07-10 V mΩ A Packing Non dry ...
Page 2
... GS T =175 ° =- GSS =-4 DS(on =-50 A DS(on |>2 DS(on)max =- K/W the chip is able to carry 123 A. thJC 2 (one layer, 70 µm thick) copper area for drain page 2 SPD50P03L G Values Unit min. typ. max -0.1 -1 µA - -10 -100 - -10 -100 nA - 8.5 12.5 mΩ - 5.7 7.0 , ...
Page 3
... Symbol Conditions C iss oss V =- MHz DS C rss t d(on Ω R d(off =- =- =- =- - =- =-50 A plateau =25 ° S,pulse = =25 ° =- =| /dt =100 A/µ page 3 SPD50P03L G Values min. typ. max. - 4590 6880 - 1220 1830 - 1000 1500 - 14 21 139 208 - 104 156 - -14 -19 - -35 -53 - -95 -126 - -3 - -200 - -1 -1. Unit 2008-07-10 ...
Page 4
... Rev. 1.8 2 Drain current I =f 120 160 200 0 [° Max. transient thermal impedance Z =f(t thJC p parameter µs 10 µ 100 µ [V] DS page 4 SPD50P03L G |≥ 120 160 T [° 0.5 0.2 0.1 0.05 0.02 0.01 single pulse - [s] p 200 -1 10 2008-07-10 ...
Page 5
... V 140 120 100 Typ. transfer characteristics I =f |>2 DS(on)max parameter Rev. 1.8 6 Typ. drain-source on resistance R =f(I DS(on) parameter - Typ. forward transconductance g =f 100 C ° °175 [V] GS page 5 SPD50P03L =25 ° -4 120 160 -I [A] D =25 ° [A] D 200 60 2008-07-10 ...
Page 6
... Forward characteristics of reverse diode I =f parameter: T 1000 Ciss 100 Coss Crss [V] DS page 6 SPD50P03L SPD50P03L G =-250 µ 98%. typ 100 140 T [° °C, typ 175 °C, typ 25 °C, 98% 175 °C, 98% 0 0 [V] SD 180 2 ...
Page 7
... Drain-source breakdown voltage =-250 µ BR(DSS -60 - Rev. 1.8 14 Typ. gate charge V =f(Q GS parameter ° °100 8 C °150 100 1000 [µ Gate charge waveforms s(th) Q g(th) 100 140 180 [°C] j page 7 SPD50P03L =-50 A pulsed gate 15 100 -Q [nC] gate 120 Q g ate 2008-07-10 ...
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... Package Outline PG-TO252-5: Outline Footprint Dimensions in mm Rev. 1.8 Packaging Tape page 8 SPD50P03L G 2008-07-10 ...
Page 9
... Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.8 page 9 SPD50P03L SPD50P03L G 2008-07-10 ...