FDMC2523P Fairchild Semiconductor, FDMC2523P Datasheet

FDMC2523P

Manufacturer Part Number

FDMC2523P

Description

MOSFET P-CH 150V 3A MLP 3.3SQ

Manufacturer

Fairchild Semiconductor

Series

QFET™r

Datasheet

1.FDMC2523P.pdf (7 pages)

Specifications of FDMC2523P

Fet Type

MOSFET P-Channel, Metal Oxide

Fet Feature

Standard

Rds On (max) @ Id, Vgs

1.5 Ohm @ 1.5A, 10V

Drain To Source Voltage (vdss)

150V

Current - Continuous Drain (id) @ 25° C

Vgs(th) (max) @ Id

5V @ 250µA

Gate Charge (qg) @ Vgs

9nC @ 10V

Input Capacitance (ciss) @ Vds

270pF @ 25V

Power - Max

42W

Mounting Type

Surface Mount

Package / Case

8-MLP, Power33

Configuration

Single

Transistor Polarity

P-Channel

Resistance Drain-source Rds (on)

1.5 Ohms

Forward Transconductance Gfs (max / Min)

1.4 S

Drain-source Breakdown Voltage

- 150 V

Gate-source Breakdown Voltage

+/- 30 V

Continuous Drain Current

3 A

Power Dissipation

42 W

Maximum Operating Temperature

+ 150 C

Mounting Style

SMD/SMT

Minimum Operating Temperature

- 55 C

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

FDMC2523PTR

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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

Updated process quality documentation, such as FMEAs and Control Plans, are available for

viewing upon request.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Lam, HH

E-mail: HH.Lam@fairchildsemi.com

Phone: 604 850 2392

Implementation of change:

Expected 1st Device Shipment Date: 2008/03/20

Earliest Year/Work Week of Changed Product: 0813

Change Type Description: Mold Compound

Description of Change (From): 8L MLP3x3 package assembly at all FSC approved

manufacturing location(s) (Carsem) using non Green mold compound as shown in table 1.

Description of Change (To): 8L MLP 3x3 package assembly at all FSC approved manufacturing

location(s) (Carsem) using Green mold compound as shown in table 2.

Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is

dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level

interconnect lead-free and RoHS compliance. The referenced material changes have been made

to provide a 'Full Green' (Halogen Free Flame Retardant) package. For additional details on the

corporate wide green initiative please visit our Web site at:

http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same

assembly facilities producing the current non-green products. Package outline drawings of the

affected products remain un-changed. Green products will be fully compliant to all published

data sheet specifications and will be interchangeable with current non-green product. Quality

and reliability will remain at the highest standards already demonstrated with Fairchild's

existing products.

Qual/REL Plan Numbers : Q20070296

Qualification :

All the reliability tests defined in this qual plan completed with no failures. Therefore

Carsem is qualified to assemble MLP 3x3 8L package.

DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL

Technical Contact:

Name: Po, Peter

E-mail: peter.po@fairchildsemi.com

Phone: 604 850 2744

Date Issued On : 2008/03/17

Date Created : 2008/01/25

PCN# : Q4074601-A

Pg. 1

Related parts for FDMC2523P

FDMC2523P Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

Change From Change To Results/Discussion Test: (Autoclave) Lot Device Q20070296BAACLV FDMC2674 Q20070296CAACLV FDMC8854 Test: (High Temperature Gate Bias) Lot Device Q20070296BAHTGB FDMC2674 Q20070296BAHTGB FDMC2674 Q20070296CAHTGB FDMC8854 Q20070296CAHTGB FDMC8854 Test: (High Temperature Reverse Bias) Lot Device Q20070296BAHTRB FDMC2674 Q20070296BAHTRB FDMC2674 Q20070296CAHTRB ...

Page 3

... FDMC2674 Q20070296CAPCNL1A FDMC8854 Product Id Description : This Final PCN covers Fairchild Semiconductor MLP3x3 8L packages. For a complete listing of products covered in this PCN release, please refer to the affected FSID listing. Affected FSIDs : FDM3300NZ FDM3622_NL FDMC2523P FDMC3300NZA FDMC8854 0/77 0/77 0/77 0/77 0/77 0/77 264-HOURS ...

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