BSO301SP Infineon Technologies, BSO301SP Datasheet - Page 2

no-image

BSO301SP

Manufacturer Part Number
BSO301SP
Description
MOSFET P-CH 30V 12.6A DSO-8
Manufacturer
Infineon Technologies
Series
OptiMOS™r
Datasheet

Specifications of BSO301SP

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
8 mOhm @ 14.9A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
12.6A
Vgs(th) (max) @ Id
2V @ 250µA
Gate Charge (qg) @ Vgs
136nC @ 10V
Input Capacitance (ciss) @ Vds
5890pF @ 25V
Power - Max
1.79W
Mounting Type
Surface Mount
Package / Case
DSO-8
Configuration
Single Quad Drain Triple Source
Transistor Polarity
P-Channel
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
14.9 A
Power Dissipation
1790 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Request inventory verification / Request inventory verification
Other names
BSO301SPINTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BSO301SP
Manufacturer:
INFINEON
Quantity:
2 099
Part Number:
BSO301SP
Manufacturer:
AD
Quantity:
25
Part Number:
BSO301SP
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Company:
Part Number:
BSO301SP
Quantity:
410
Part Number:
BSO301SP H
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Company:
Part Number:
BSO301SP H
Quantity:
52
Part Number:
BSO301SPH
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Company:
Part Number:
BSO301SPH
Quantity:
95
Rev. 1.31
1)
connection. PCB is vertical in still air.
Parameter
Thermal characteristics
Thermal resistance,
junction - soldering point
Thermal resistance,
junction - ambient
Electrical characteristics, at T
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Zero gate voltage drain current
Gate-source leakage current
Drain-source on-state resistance
Drain-source on-state resistance
Transconductance
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
j
=25 °C, unless otherwise specified
Symbol Conditions
R
R
V
V
I
I
R
R
g
DSS
GSS
fs
(BR)DSS
GS(th)
thJS
thJA
DS(on)
DS(on)
minimal footprint,
t
minimal footprint,
steady state
6 cm
t
6 cm
steady state
V
V
I
V
T
V
T
V
V
V
|V
I
p
p
D
D
page 2
≤10 s
≤10 s
j
j
GS
DS
DS
DS
GS
GS
GS
=-250 µA
=25 °C
=125 °C
=-14.9 A
DS
=V
=-30 V, V
=-30 V, V
=0 V, I
=-20 V, V
=-4.5 V, I
=-10 V, I
|>2|I
2
2
cooling area
cooling area
GS
,
D
2
|R
D
(one layer, 70 µm thick) copper area for drain
=-250µA
D
DS(on)max
D
GS
GS
DS
=-14.9 A
=-12 A
=0 V,
=0 V,
=0 V
1)
1)
,
,
,
min.
-30
22
-1
-
-
-
-
-
-
-
-
-
-
Values
typ.
-1.5
-0.1
-10
-10
8.8
6.3
44
-
-
-
-
-
-
BSO301SP H
max.
-100
-100
110
150
8.0
35
50
80
12
-2
-1
-
-
Unit
K/W
V
µA
nA
mΩ
S
2010-02-08

Related parts for BSO301SP