IPD25CNE8N G Infineon Technologies, IPD25CNE8N G Datasheet

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IPD25CNE8N G

Manufacturer Part Number
IPD25CNE8N G
Description
MOSFET N-CH 85V 35A TO252-3
Manufacturer
Infineon Technologies
Series
OptiMOS™r
Datasheet

Specifications of IPD25CNE8N G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
25 mOhm @ 35A, 10V
Drain To Source Voltage (vdss)
85V
Current - Continuous Drain (id) @ 25° C
35A
Vgs(th) (max) @ Id
4V @ 39µA
Gate Charge (qg) @ Vgs
31nC @ 10V
Input Capacitance (ciss) @ Vds
2070pF @ 40V
Power - Max
71W
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
SP000096457
Rev. 1.07
1)
2)
3)
Features
• N-channel, normal level
• Excellent gate charge x R
• Very low on-resistance R
• 175 °C operating temperature
• Pb-free lead plating; RoHS compliant
• Qualified according to JEDEC
• Ideal for high-frequency switching and synchronous rectification
• Halogen-free according to IEC61249-2-21 *
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Reverse diode dv /dt
Gate source voltage
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
OptiMOS
Type
Package
Marking
J-STD20 and JESD22
* Except D-PAK ( TO-252 )
T
see figure 3
jmax
=150°C and duty cycle D=0.01 for Vgs<-5V
2 Power-Transistor
IPB26CNE8N G
PG-TO263-3
26CNE8N
2)
3)
j
=25 °C, unless otherwise specified
DS(on)
DS(on)
1)
product (FOM)
for target application
IPD25CNE8N G
PG-TO252-3
25CNE8N
Symbol Conditions
I
I
E
dv /dt
V
P
T
D
D,pulse
j
AS
GS
tot
, T
stg
T
T
T
I
I
di /dt =100 A/µs,
T
T
D
D
page 1
C
C
C
j,max
C
=35 A, R
=35 A, V
=25 °C
=100 °C
=25 °C
=25 °C
IPI26CNE8N G IPP26CNE8N G IPU25CNE8N G
IPI26CNE8N G
PG-TO262-3
26CNE8N
=175 °C
DS
GS
=68 V,
=25 Ω
Product Summary
V
R
I
D
DS
DS(on),max (TO252)
IPB26CNE8N G IPD25CNE8N G
IPP26CNE8N G
PG-TO220-3
26CNE8N
-55 ... 175
55/175/56
Value
140
±20
35
25
65
71
6
IPU25CNE8N G
PG-TO251-3
25CNE8N
85
25
35
Unit
A
mJ
kV/µs
V
W
°C
V
mΩ
A
2010-04-28

Related parts for IPD25CNE8N G

IPD25CNE8N G Summary of contents

Page 1

... PG-TO262-3 25CNE8N 26CNE8N Symbol Conditions I T =25 ° =100 ° =25 °C D,pulse C =25 Ω = = = /dt di /dt =100 A/µs, T =175 °C j,max =25 °C tot stg page 1 IPB26CNE8N G IPD25CNE8N mΩ IPP26CNE8N G IPU25CNE8N G PG-TO220-3 PG-TO251-3 26CNE8N 25CNE8N Value Unit 140 kV/µs ± -55 ... 175 °C 55/175/56 2010-04-28 ...

Page 2

... GS(th = DSS T =25 ° = =125 ° = GSS = = DS(on) (TO252 (TO251 (TO263 (TO220, TO262 |>2 DS(on)max = (one layer, 70 µm thick) copper area for drain page 2 IPB26CNE8N G IPD25CNE8N G Values Unit min. typ. max 2.1 K 0.1 1 µ 100 - 1 100 mΩ Ω 2010-04-28 ...

Page 3

... See figure 16 for gate charge parameter definition Rev. 1.07 IPI26CNE8N G IPP26CNE8N G IPU25CNE8N G Symbol Conditions C iss = oss f =1 MHz C rss t d( =1.6 Ω d(off = = plateau oss =25 ° S,pulse = =25 ° = /dt =100 A/µ page 3 IPB26CNE8N G IPD25CNE8N G Values Unit min. typ. max. - 1560 2070 pF - 288 383 - 5 140 - 1 1 165 - nC 2010-04-28 ...

Page 4

... IPI26CNE8N G IPP26CNE8N G IPU25CNE8N G 2 Drain current I =f 100 150 200 0 [° Max. transient thermal impedance Z =f(t thJC p parameter µs 10 µs 100 µ 0 [V] DS page 4 IPB26CNE8N G IPD25CNE8N G ≥ 100 150 T [° 0.5 0.2 0.1 0.05 0.02 0.01 t [s] p single pulse 200 2010-04-28 ...

Page 5

... parameter 100 Typ. transfer characteristics I =f |>2 DS(on)max parameter Rev. 1.07 IPI26CNE8N G IPP26CNE8N G IPU25CNE8N G 6 Typ. drain-source on resistance R =f(I DS(on) parameter Typ. forward transconductance g =f 175 ° ° [V] GS page 5 IPB26CNE8N G IPD25CNE8N =25 ° 5 [A] D =25 ° [ 2010-04-28 ...

Page 6

... I 4 3.5 3 2.5 2 typ 1 100 140 180 -60 [° Forward characteristics of reverse diode I =f parameter: T 1000 100 [V] DS page 6 IPB26CNE8N G IPD25CNE8N 390 µA 39 µ 100 140 T [° °C 175 °C 175 °C, 98% 25 °C, 98% 0 0.5 1 1.5 V [V] SD 180 2 2010-04-28 ...

Page 7

... Drain-source breakdown voltage V =f BR(DSS 100 -60 - Rev. 1.07 IPI26CNE8N G IPP26CNE8N G IPU25CNE8N G 14 Typ. gate charge V =f(Q GS parameter °C 100 ° 100 1000 [µ Gate charge waveforms s(th) Q g(th) 60 100 140 180 [°C] j page 7 IPB26CNE8N G IPD25CNE8N =35 A pulsed gate [nC] gate ate 2010-04-28 ...

Page 8

... PG-TO220-3: Outline Rev. 1.07 IPB26CNE8N G IPD25CNE8N G IPI26CNE8N G IPP26CNE8N G IPU25CNE8N G page 8 2010-04-28 ...

Page 9

... PG-TO-263 (D²-Pak) Rev. 1.07 IPB26CNE8N G IPD25CNE8N G IPI26CNE8N G IPP26CNE8N G IPU25CNE8N G page 9 2010-04-28 ...

Page 10

... PG-TO262-3-1 (I²PAK) Rev. 1.07 IPB26CNE8N G IPD25CNE8N G IPI26CNE8N G IPP26CNE8N G IPU25CNE8N G page 10 2010-04-28 ...

Page 11

... PG-TO252-3: Outline Rev. 1.07 IPB26CNE8N G IPD25CNE8N G IPI26CNE8N G IPP26CNE8N G IPU25CNE8N G page 11 2010-04-28 ...

Page 12

... PG-TO251-3: Outline Rev. 1.07 IPB26CNE8N G IPD25CNE8N G IPI26CNE8N G IPP26CNE8N G IPU25CNE8N G page 12 2010-04-28 ...

Page 13

... Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.07 IPB26CNE8N G IPD25CNE8N G IPI26CNE8N G IPP26CNE8N G IPU25CNE8N G page 13 2010-04-28 ...

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