PIC16LF1847-E/ML Microchip Technology, PIC16LF1847-E/ML Datasheet - Page 345

• Manufacturer Part Number: PIC16LF1847-E/ML
• Description: 14 KB Flash, 1K Bytes RAM, 32 MHz Int. Osc, 16 I/0, Enhanced Mid Range Core, Nan
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ mTouch™ 16Fr

Specifications of PIC16LF1847-E/ML

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 15
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-VQFN Exposed Pad
• Core: PIC
• Processor Series: PIC16LF
• Data Bus Width: 8 bit
• Maximum Clock Frequency: 32 MHz
• Data Ram Size: 256 B
• Number Of Programmable I/os: 15
• Number Of Timers: ÿ4 x 8-bit, 1 x 16-bit
• Operating Supply Voltage: 1.8 V to 5.5 V
• Mounting Style: Through Hole
• Interface Type: SPI, I2C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

30.0
Absolute Maximum Ratings
Ambient temperature under bias....................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on V
Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current out of V
Maximum current into V
Maximum current into V
Clamp current, I
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Note 1:
 2011 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
ELECTRICAL SPECIFICATIONS
Power dissipation is calculated as follows: P
DD
DD
with respect to V
with respect to V
K
(V
PIN
(1)
DD
DD
< 0 or V
............................................................................................................................... 800 mW
SS
SS
pin, -40°C  T
pin, -40°C  T
pin, -40°C  T
pin, -40°C  T
PIN
SS
SS
, PIC16F1847 ............................................................................. -0.3V to +6.5V
, PIC16LF1847 ........................................................................... -0.3V to +4.0V
> V
(†)
DD
A
A
SS
)20 mA
A
A
 +85°C for industrial.................................................................. 150 mA
 +125°C for extended ................................................................. 70 mA
 +85°C for industrial............................................................... 210 mA
 +125°C for extended .............................................................. 95 mA
........................................................................... -0.3V to (V
Preliminary
DIS
= V
DD
x {I
DD
–  I
OH
} +  {(V
PIC16(L)F1847
DD
– V
OH
) x I
DS41453B-page 347
OH
} + (V
DD
+ 0.3V)
O
l x I
OL
).