MT47H64M16HR-25E:H Micron Technology Inc, MT47H64M16HR-25E:H Datasheet - Page 6

• Manufacturer Part Number: MT47H64M16HR-25E:H
• Description: 64MX16 DDR2 SDRAM PLASTIC PBF FBGA 1.8V
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr
• Series: -r

Specifications of MT47H64M16HR-25E:H

• Organization: 64Mx16
• Density: 1Gb
• Address Bus: 16b
• Access Time (max): 400ps
• Maximum Clock Rate: 800MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 160mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 1G (64M x 16)
• Speed: 2.5ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 84-TFBGA
• Lead Free Status / Rohs Status: Compliant

List of Tables
Table 1: Key Timing Parameters ...................................................................................................................... 2
Table 2: Addressing ......................................................................................................................................... 2
Table 3: FBGA 84-Ball – x16 and 60-Ball – x4, x8 Descriptions .......................................................................... 17
Table 4: Input Capacitance ............................................................................................................................ 22
Table 5: Absolute Maximum DC Ratings ........................................................................................................ 23
Table 6: Temperature Limits .......................................................................................................................... 24
Table 7: Thermal Impedance ......................................................................................................................... 25
Table 8: General I
Table 9: I
Table 10: DDR2 I
Table 11: DDR2 I
Table 12: AC Operating Specifications and Conditions .................................................................................... 34
Table 13: Recommended DC Operating Conditions (SSTL_18) ........................................................................ 44
Table 14: ODT DC Electrical Characteristics ................................................................................................... 45
Table 15: Input DC Logic Levels ..................................................................................................................... 46
Table 16: Input AC Logic Levels ..................................................................................................................... 46
Table 17: Differential Input Logic Levels ........................................................................................................ 47
Table 18: Differential AC Output Parameters .................................................................................................. 49
Table 19: Output DC Current Drive ................................................................................................................ 49
Table 20: Output Characteristics .................................................................................................................... 50
Table 21: Full Strength Pull-Down Current (mA) ............................................................................................ 51
Table 22: Full Strength Pull-Up Current (mA) ................................................................................................. 52
Table 23: Reduced Strength Pull-Down Current (mA) ..................................................................................... 53
Table 24: Reduced Strength Pull-Up Current (mA) .......................................................................................... 54
Table 25: Input Clamp Characteristics ........................................................................................................... 55
Table 26: Address and Control Balls ............................................................................................................... 56
Table 27: Clock, Data, Strobe, and Mask Balls ................................................................................................. 56
Table 28: AC Input Test Conditions ................................................................................................................ 57
Table 29: DDR2-400/533 Setup and Hold Time Derating Values (
Table 30: DDR2-667/800/1066 Setup and Hold Time Derating Values (
Table 31: DDR2-400/533
Table 32: DDR2-667/800/1066
Table 33: Single-Ended DQS Slew Rate Derating Values Using
Table 34: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
Table 35: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
Table 36: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
Table 37: Truth Table – DDR2 Commands ..................................................................................................... 71
Table 38: Truth Table – Current State Bank n – Command to Bank n ............................................................... 72
Table 39: Truth Table – Current State Bank n – Command to Bank m .............................................................. 74
Table 40: Minimum Delay with Auto Precharge Enabled ................................................................................. 75
Table 41: Burst Definition .............................................................................................................................. 79
Table 42: READ Using Concurrent Auto Precharge ......................................................................................... 99
Table 43: WRITE Using Concurrent Auto Precharge ....................................................................................... 105
Table 44: Truth Table – CKE ......................................................................................................................... 120
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
DD7
Timing Patterns (8-Bank Interleave READ Operation) ................................................................. 27
DD
DD
DD
Specifications and Conditions (Die Revisions E and G) ..................................................... 28
Specifications and Conditions (Die Revision H) ................................................................ 31
Parameters .................................................................................................................... 26
t
DS,
t
DH Derating Values with Differential Strobe ..................................................... 63
t
DS,
t
DH Derating Values with Differential Strobe ............................................ 64
6
t
DS
t
Micron Technology, Inc. reserves the right to change products or specifications without notice.
IS and
b
and
REF
REF
REF
t
) at DDR2-667 ..................................... 65
) at DDR2-533 ..................................... 66
) at DDR2-400 ..................................... 66
IS and
t
t
DH
IH) ................................................... 59
1Gb: x4, x8, x16 DDR2 SDRAM
b
.................................................. 65
t
IH) .......................................... 60
© 2004 Micron Technology, Inc. All rights reserved.