A80960HD80S L2GK Intel, A80960HD80S L2GK Datasheet - Page 32

• Manufacturer Part Number: A80960HD80S L2GK
• Manufacturer: Intel

Specifications of A80960HD80S L2GK

• Family Name: i960
• Device Core Size: 32b
• Frequency (max): 80MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Supply Voltage (max): 3.45V
• Operating Supply Voltage (min): 3.15V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Through Hole
• Pin Count: 168
• Package Type: CPGA
• Lead Free Status / RoHS Status: Compliant

80960HA/HD/HT
32
Table 12. Maximum T
Table 13. 80960Hx 168-Pin PGA Package Thermal Characteristics
Core
1X Bus
Clock
Core
2X Bus
Clock
Core
3X Bus
Clock
† *0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
(Case measured as
shown in
(No Heatsink)
(With Heatsink)
NOTES:
1. This table applies to 80960Hx PGA plugged into socket or soldered directly to board.
2.
3. 0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
Junction-to-Case
Case-to-Ambient
Case-to-Ambient
JA
Parameter
=
Figure
JC
T
Heatsink
T
without
Heatsink
T
Heatsink
T
without
Heatsink
T
Heatsink
T
without
Heatsink
+
A
A
A
A
A
A
A
3
with
with
with
at Various Airflows in °C (PGA Package Only)
CA
5.)
†
†
†
Thermal Resistance — °C/Watt
1.5
(0)
17
13
f
(MHz)
0
CLKIN
25
33
40
25
33
40
16
25
33
40
16
25
33
40
20
25
20
25
(1.01)
200
1.5
14
9
Airflow — ft./min (m/sec)
(0)
69
63
59
64
56
50
68
58
49
41
62
49
38
27
53
45
43
33
0
(2.03)
400
1.5
11
6
(3.07)
(1.01)
600
200
1.5
74
70
67
67
62
56
73
66
60
55
66
56
46
38
63
58
51
42
9
5
(4.06)
800
Airflow-ft/min (m/sec)
1.5
8
4
(2.03)
400
78
75
73
71
67
63
77
73
69
65
71
62
55
48
71
67
58
51
(5.07)
1000
1.5
7
4
(3.04)
600
79
77
75
74
70
67
79
75
71
68
73
66
60
55
73
70
63
58
JA
(4.06)
800
80
79
77
75
72
69
80
77
74
72
75
68
63
58
76
73
66
61
JC
Datasheet
(5.07)
1000
80
79
77
76
74
71
80
77
74
72
76
71
66
62
76
73
68
64