A80960HD80S L2GK Intel, A80960HD80S L2GK Datasheet - Page 4

A80960HD80S L2GK

Manufacturer Part Number
A80960HD80S L2GK
Description
Manufacturer
Intel
Datasheet

Specifications of A80960HD80S L2GK

Family Name
i960
Device Core Size
32b
Frequency (max)
80MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Supply Voltage (max)
3.45V
Operating Supply Voltage (min)
3.15V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Through Hole
Pin Count
168
Package Type
CPGA
Lead Free Status / RoHS Status
Compliant
Contents
4
7
8
9
10 Output Delay Waveform ............................................................................................................. 46
11 Output Delay Waveform ............................................................................................................. 46
12 Output Float Waveform .............................................................................................................. 47
13 Input Setup and Hold Waveform ................................................................................................ 47
14 NMI, XINT7:0 Input Setup and Hold Waveform.......................................................................... 47
15 Hold Acknowledge Timings ........................................................................................................ 48
16 Bus Backoff (BOFF) Timings ...................................................................................................... 48
17 TCK Waveform ........................................................................................................................... 49
18 Input Setup and Hold Waveforms for T
19 Output Delay and Output Float for TBSOV1 and TBSOF1 ........................................................ 50
20 Output Delay and Output Float Waveform for TBSOV2 and TBSOF2 ....................................... 50
21 Input Setup and Hold Waveform for TBSIS2 and TBSIH2 ......................................................... 50
22 Rise and Fall Time Derating at 85 °C and Minimum VCC.......................................................... 51
23 I
24 I
25 Output Delay or Hold vs. Load Capacitance .............................................................................. 52
26 Output Delay vs. Temperature ................................................................................................... 53
27 Output Hold Times vs. Temperature .......................................................................................... 53
28 Output Delay vs. VCC ................................................................................................................ 53
29 Cold Reset Waveform ................................................................................................................ 54
30 Warm Reset Waveform .............................................................................................................. 55
31 Entering ONCE Mode................................................................................................................. 56
32 Non-Burst, Non-Pipelined Requests without Wait States ........................................................... 57
33 Non-Burst, Non-Pipelined Read Request with Wait States ........................................................ 58
34 Non-Burst, Non-Pipelined Write Request with Wait States ........................................................ 59
35 Burst, Non-Pipelined Read Request without Wait States, 32-Bit Bus ........................................ 60
36 Burst, Non-Pipelined Read Request with Wait States, 32-Bit Bus ............................................. 61
37 Burst, Non-Pipelined Write Request without Wait States, 32-Bit Bus ........................................ 62
38 Burst, Non-Pipelined Write Request with Wait States, 32-Bit Bus ............................................. 63
39 Burst, Non-Pipelined Read Request with Wait States, 16-Bit Bus ............................................. 64
40 Burst, Non-Pipelined Read Request with Wait States, 8-Bit Bus ............................................... 65
41 Non-Burst, Pipelined Read Request without Wait States, 32-Bit Bus ........................................ 66
42 Non-Burst, Pipelined Read Request with Wait States, 32-Bit Bus ............................................. 67
43 Burst, Pipelined Read Request without Wait States, 32-Bit Bus ................................................ 68
44 Burst, Pipelined Read Request with Wait States, 32-Bit Bus ..................................................... 69
45 Burst, Pipelined Read Request with Wait States, 8-Bit Bus ....................................................... 70
46 Burst, Pipelined Read Request with Wait States, 16-Bit Bus ..................................................... 71
47 Using External READY............................................................................................................... 72
48 Terminating a Burst with BTERM ............................................................................................... 73
49 BREQ and BSTALL Operation ................................................................................................... 74
50 BOFF Functional Timing. BOFF occurs during a burst or non-burst data cycle. ........................ 75
51 HOLD Functional Timing ............................................................................................................ 76
52 LOCK Delays HOLDA Timing..................................................................................................... 77
53 FAIL Functional Timing............................................................................................................... 77
54 A Summary of Aligned and Unaligned Transfers for 32-Bit Regions.......................................... 78
55 A Summary of Aligned and Unaligned Transfers for 32-Bit Regions (Continued) ...................... 79
56 A Summary of Aligned and Unaligned Transfers for 16-Bit Bus................................................. 80
VCC5 Current-Limiting Resistor ................................................................................................. 38
AC Test Load.............................................................................................................................. 45
CLKIN Waveform........................................................................................................................ 46
CC
CC
Active (Power Supply) vs. Frequency................................................................................... 51
Active (Thermal) vs. Frequency............................................................................................ 52
BSIS1
and TBSIH1.......................................................... 49
Datasheet

Related parts for A80960HD80S L2GK