KC80526LY400128 Intel, KC80526LY400128 Datasheet - Page 37
KC80526LY400128
Manufacturer Part Number
KC80526LY400128
Description
Manufacturer
Intel
Datasheet
1.KC80526LY400128.pdf
(42 pages)
Specifications of KC80526LY400128
Operating Temperature (min)
0C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
KC80526LY400128/SL544
Manufacturer:
HITACHI
Quantity:
3 270
Part Number:
KC80526LY400128/SL544
Manufacturer:
INTEL
Quantity:
20 000
5.1.3
Figure 13 shows the mechanical stack-up and the
associated component clearance requirements. This is
referred to as the module keep-out zone and should not be
entered or altered.
The system manufacturer establishes the board-to-board
clearance between the module and the system electronics
NOTE:
The topside component clearance is independent of the PCB thickness.
Printed Circuit Board
Height Restrictions
Figure 12. Printed Circuit Board Thickness
Figure 13. Keep-out Zone
by selecting one of three possible mating connectors. The
mating connector sizes are 4 millimeters, 6 millimeters, or 8
millimeters. These three options provide the system
manufacturer with flexibility in choosing components
between the two boards. Information on these connectors
can be obtained from your local Intel representative.
Intel Celeron
At 400 MHz, 366 MHz, 333 MHz, and 300 MHz
Processor Mobile Module MMC-1
min: 0.90 mm
max: 1.10 mm
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