KC80526LY400128 Intel, KC80526LY400128 Datasheet - Page 4

• Manufacturer Part Number: KC80526LY400128
• Manufacturer: Intel

Specifications of KC80526LY400128

• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

FIGURES
Figure 1. Block Diagram of the Celeron Processor
Figure 2. 280-Pin Connector Footprint Pad Numbers,
Figure 3. Clock Control States ............................................21
Figure 4. BCLK, TCK, and PICCLK Generic Clock Waveform
Figure 5. Power-on Sequence Timing.................................29
Figure 6. Instantaneous In-rush Current Model...................30
Figure 7. Instantaneous In-rush Current.............................31
Figure 8. Over Current Protection Circuit............................32
Figure 9. Spice Simulation Using In-rush Protection
Figure 10. Celeron Processor Mobile Module MMC-1 Board
Figure 11. Celeron Processor Mobile Module MMC-1 Board
Figure 12. Printed Circuit Board Thickness.........................37
Figure 13. Keep-out Zone...................................................37
Figure 14. Thermal Transfer Plate (A) ................................38
Figure 15. Thermal Transfer Plate (B) ................................39
Figure 16. Standoff Holes, Board Edge Clearance, and EMI
Figure 17. Product Tracking Code ......................................41
Mobile Module MMC-1...........................................6
Module Secondary Side.......................................18
at the Processor Core Pin....................................26
(Example Only)....................................................33
Dimensions ........................................................35
Dimensions- Pin 1 Orientation............................36
Containment Ring ..............................................40
TABLES
Table 1. Module Connector Signal Summary........................7
Table 2. Memory Signal Descriptions ...................................9
Table 3. PCI Signal Description..........................................10
Table 4. Processor/PIIX4E/M Sideband Signal
Table 5. Power Management Signal Descriptions ..............12
Table 6. Clock Signal Descriptions .....................................13
Table 7. Voltage Descriptions .............................................14
Table 8. JTAG Pins .............................................................14
Table 9. Miscellaneous Pins ...............................................15
Table 10. Connector Pin Assignments................................16
Table 11. Connector Specifications ....................................19
Table 12. Configuration Straps for the 82443DX Host Bridge
Table 13. Clock State Characteristics.................................23
Table 14. POS/STR Power.................................................23
Table 15. Power Supply Design Specifications ..................24
Table 16. AC Specifications (BCLK) at the Processor Core
Table 17. BCLK Signal Quality Specifications at the
Table 18. Typical Voltage Regulator Efficiency...................27
Table 19. Voltage Signal Definitions and Sequences .........28
Table 20. VR_ON In-rush Current ......................................29
Table 21. Capacitance Requirements per Power Plane......30
Table 22. Thermal Sensor SMBus Address Table..............34
Table 23. Thermal Sensor Configuration Register ..............35
Table 24. Thermal Design Power Specifications ................40
Table 25. Environmental Standards....................................42
Intel Celeron
At 400 MHz, 366 MHz, 333 MHz, and 300 MHz
Descriptions..........................................................11
Processor Core ...................................................26
System Controller ...............................................20
Pins .....................................................................25
Processor Mobile Module MMC-1
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